➀ LB Semicon and its subsidiary LB Lusem will provide turn-key packaging services for power management chips used in AI data centers. ➁ The services will include processing for both the front and back sides of wafers. ➂ They will also offer testing for the chips.

➀ LB Semicon and DB Hitek have announced a collaboration to co-develop an enhanced redistribution layer (RDL) for high-power chips; ➁ The RDL is a metal layer that connects the I/O pad within the chip to the outside world; ➂ This collaboration aims to improve the performance and connectivity of high-power chips.