➀ LB Semicon and DB Hitek announced a collaboration to co-develop an enhanced redistribution layer (RDL) for high power chips; ➁ The RDL is a metal layer that connects the I/O pad inside the chip to the outside; ➂ The layer is used in high-performance applications.

➀ LB Semicon and DB Hitek have announced a collaboration to co-develop an enhanced redistribution layer (RDL) for high-power chips; ➁ The RDL is a metal layer that connects the I/O pad within the chip to the outside world; ➂ This collaboration aims to improve the performance and connectivity of high-power chips.