AnandTech
AnandTech 以其深度和详尽的硬件评测而闻名，其文章通常包括对硬件技术的深入分析和基准测试。
August 19
- CXL Gathers Momentum at FMS 2024➀ CXL consortium showcased advancements at FMS 2024, including new specifications and product demonstrations. ➁ SK hynix introduced a 128 GB CMM-DDR5 CXL memory module and a Heterogeneous Memory Software Development Kit (HMSDK). ➂ Marvell announced a new CXL product line, Structera, featuring compute accelerators and memory expansion controllers.
August 16
- Fadu's FC5161 SSD Controller Breaks Cover in Western Digital's PCIe Gen5 Enterprise Drives➀ Western Digital's Ultrastar DC SN861 SSDs use Fadu's FC5161 controller, a South Korean company specializing in enterprise SSD solutions. ➁ The FC5161 supports 16 NAND channels and offers advanced enterprise features like OCP Cloud Spec 2.0 and SR-IOV. ➂ The SN861 provides high-speed performance with sequential read speeds up to 13.7 GB/s and write speeds up to 7.5 GB/s, available in capacities from 1.6 TB to 7.68 TB.
August 15
- Intel Sells Its Arm Shares, Reduces Stakes in Other Companies➀ Intel sold its entire stake in Arm Holdings during the second quarter, raising approximately $147 million. ➁ The company also exited its investment in ZeroFox and reduced its involvement with Astera Labs as part of a broader cost management strategy. ➂ Intel reported a $120 million net loss on its equity investments for the quarter, amidst significant financial challenges.
August 14
- The AMD Ryzen 9 9950X and Ryzen 9 9900X Review: Flagship Zen 5 Soars - and Stalls➀ AMD has launched the Ryzen 9 9950X and Ryzen 9 9900X, the remaining two models of the Ryzen 9000 series, featuring the latest Zen 5 architecture. ➁ The Ryzen 9 9950X boasts 16 Zen 5 cores and a boost clock up to 5.7 GHz, while the Ryzen 9 9900X has 12 Zen 5 cores with a boost clock up to 5.6 GHz. ➂ Despite a slight delay, all Ryzen 9000 series processors are now available, compatible with existing AM5 sockets and X670E/X670 motherboards.
- G.Skill Intros Low Latency DDR5 Memory Modules: CL30 at 6400 MT/s➀ G.Skill has introduced ultra-low-latency DDR5-6400 memory modules with CL30 timings, the most aggressive yet for DDR5-6400 sticks. ➁ These modules are designed for both AMD and Intel systems, offering a significant reduction in latency compared to JEDEC standards. ➂ The new memory kits will be available starting late August 2024, targeting high-end motherboards and properly cooled CPUs.
- Kioxia Demonstrates Optical Interface SSDs for Data Centers➀ Kioxia demonstrated an optical interface SSD at FMS, developed with funding from NEDO to reduce data center power consumption by up to 40%. ➁ The optical interface allows for data transfer over long distances, enabling storage to be kept in separate rooms with minimal cooling requirements. ➂ The demonstration showed a slight loss in IOPS performance but significant latency advantages over traditional copper network links.
August 13
- Silicon Motion Demonstrates Flexible Data Placement on MonTitan Gen 5 Enterprise SSD Platform➀ Silicon Motion demonstrated the flexibility of their MonTitan Gen 5 Enterprise SSD Platform at FMS 2024, showcasing its ability to optimize data placement for AI data pipelines. ➁ The platform utilizes the NVM Express standard's Flexible Data Placement (FDP) feature to reduce write amplification and improve performance. ➂ Silicon Motion's approach allows for customization and flexibility, appealing to flash array vendors and differentiating from competitors like Phison.
- Kioxia Demonstrates RAID Offload Scheme for NVMe Drives➀ Kioxia demonstrated a new RAID offload methodology for enterprise SSDs at FMS 2024, aiming to address performance scaling issues in RAID arrays. ➁ The proposed solution utilizes PCIe direct memory access and the SSD controller's memory buffer (CMB) to avoid data movement to the CPU. ➂ The PoC showed significant reductions in CPU and system DRAM utilization, and Kioxia plans to contribute this feature to the NVM Express working group for potential standardization.
- Western Digital Introduces 4 TB microSDUC, 8 TB SDUC, and 16 TB External SSDs➀ Western Digital introduces 4 TB microSDUC and 8 TB SDUC cards with UHS-I speeds, and two 16 TB external SSDs. ➁ All products utilize BiCS8 QLC NAND technology. ➂ The 16 TB external SSDs include a SanDisk Desk Drive and a SanDisk Extreme Pro model, with the latter being a technology demonstration.
- The Noctua NH-D15 G2 LBC Cooler Review: Notoriously Big, Incredibly Good➀ The Noctua NH-D15 G2 LBC cooler is a high-performance option for PC enthusiasts, known for its exceptional build quality and cooling efficiency. ➁ Priced at $150, it offers the best performance currently achievable by an air cooler. ➂ Available in three versions, it caters to specific CPU needs with variants designed for AMD AM5 and Intel LGA1700 processors, while the standard version focuses on long-term compatibility.
August 12
- Kioxia Details BiCS 8 NAND at FMS 2024: 216 Layers With Superior Scaling➀ Kioxia showcased its BiCS 8 3D NAND technology at FMS 2024, featuring 218 layers and a new CMOS Bonded Array (CBA) process. ➁ The CBA process allows independent parallel processing of CMOS wafer and cell array wafer, improving reliability and performance. ➂ Despite fewer layers compared to competitors, Kioxia's lateral scaling enables competitive bit density and operating speeds.
August 9
- Western Digital Previews M.2 2280 PCIe 5.0 x4 NVMe Client SSDs➀ Western Digital showcased their upcoming PCIe 5.0 x4 M.2 2280 NVMe SSDs at FMS 2024, targeting mobile workstations and consumer desktops. ➁ The company demonstrated two versions: a performance segment drive with an 8-channel controller and a mainstream version with a 4-channel DRAM-less controller, both using BiCS8 218-layer 3D TLC. ➂ Western Digital emphasized the power efficiency of their platform, promising low power consumption under stressful traffic, making it suitable for both mobile workstations and desktops.
August 8
- AMD Launches New Ryzen & Radeon Gaming Bundle: Warhammer 40,000: Space Marine 2 and Unknown 9: Awakening➀ AMD is offering a new gaming bundle featuring Warhammer 40,000: Space Marine 2 and Unknown 9: Awakening with the purchase of select Ryzen 7000 CPUs and Radeon RX 7000 video cards. ➁ The bundle includes both desktop and laptop hardware, excluding the upcoming Ryzen 9000 series. ➂ The promotion is available through participating retailers in the U.S. and Canada, starting August 6, 2024, and ending October 5, 2024.
August 7
- Western Digital Teases 128 TB Enterprise SSD: BiCS8 3D QLC for AI Workloads➀ Western Digital has teased a 128 TB SSD using BiCS8 QLC NAND, designed for AI data lakes and capacity-intensive applications. ➁ The BiCS8 NAND features 218 layers and a hybrid bonding scheme, suitable for Gen 4+ drives. ➂ The SSD's firmware is optimized for AI checkpointing, supporting sequential writes and simultaneous read operations.
- The AMD Ryzen 7 9700X and Ryzen 5 9600X Review: Zen 5 is Alive➀ AMD has launched the Ryzen 7 9700X and Ryzen 5 9600X, mid-range desktop processors featuring the Zen 5 microarchitecture. ➁ Both processors offer high boost clock speeds, with the Ryzen 7 9700X reaching up to 5.5 GHz and the Ryzen 5 9600X up to 5.4 GHz. ➂ The Ryzen 9000 series uses the same AM5 socket as its predecessor, allowing for compatibility with existing motherboards after a firmware update.
August 6
- Samsung Shrinks LPDDR5X Chips by 9%, Now Just 0.65mm Thick➀ Samsung has started mass production of 12 GB and 16 GB LPDDR5X modules in the industry's thinnest package, measuring 0.65 mm in thickness. ➁ The ultra-thin design was achieved through new packaging methods and an optimized back-lapping process, offering a 21.2% improvement in heat resistance. ➂ Thinner LPDDR5X packaging enhances airflow within smartphones, significantly improving thermal management and potentially extending device lifespan.
August 2
- Western Digital: We Are Sampling 32TB SMR Hard Drives1. Western Digital has announced the sampling of a 32TB hard drive using EAMR and SMR technologies, targeting hyperscalers. 2. The drive incorporates advanced technologies such as ePMR, triple-stage actuators, OptiNAND, and UltraSMR for enhanced capacity and reliability. 3. This move brings Western Digital's capacity on par with Seagate's 30TB Exos HDDs, although Seagate still leads in areal density.
- ECS LIVA Z5 PLUS mini-PC Review: A Different Take on Raptor Lake1. The ECS LIVA Z5 PLUS mini-PC is designed for business and industrial use-cases, fitting between the ultra-compact form-factor and industrial-oriented 3.5" SBC. 2. It features an Intel U series processor with a slightly increased configurable TDP compared to the standard 15W operating point. 3. The review covers the performance and features of the ECS LIVA Z5 PLUS, highlighting the advantages of its slightly larger form-factor.
- Intel Extends 13th & 14th Gen Core Retail CPU Warranties By 2 Years In Response to Chip Instability Issues1. Intel has extended the warranty period for its 13th and 14th Gen Core retail CPUs by two years due to chip instability issues. 2. The extended warranty aims to address ongoing stability issues with desktop Raptor Lake chips and provides a total warranty period of five years. 3. The extended warranty only applies to boxed processors, not tray processors sold to OEMs and certain distributors.
- Report: Intel Meteor Lake In Short Supply Due to Yield Issues, Intel Running Hot Lots1. Intel is facing yield issues with its Meteor Lake chips, leading to short supply. 2. The company has resorted to running 'hot lots' to expedite production and meet demand. 3. Despite the challenges, Intel has shipped 15 million AI PC chips since the launch of Meteor Lake.
- Intel Bleeds Red, Plans 15% Workforce Layoff and $10B Cuts For 20251. Intel plans to cut $10 billion in costs by 2025, including a 15% workforce reduction affecting 15,000 employees. 2. The company aims to reduce spending on R&D, marketing, administration, and capital expenditures. 3. Intel will also simplify its product portfolio and suspend its dividend to focus on core competencies and regain profitability.
July 31
- Micron Ships Denser & Faster 276 Layer TLC NAND, Arriving First In Micron 2650 Client SSDs1. Micron has started shipping its 9th Generation 276-layer TLC NAND, offering significant improvements in density and performance. 2. The new NAND features a 44% increase in density over the previous generation and supports transfer rates up to 3600 MT/sec. 3. Micron's 2650 client SSD is the first product to utilize this new NAND technology, providing high-speed storage solutions for various applications.
- The Cooler Master V Platinum V2 1600W ATX 3.1 PSU Review: Quiet Giant1. Cooler Master's V Platinum 1600 V2 is a high-capacity ATX 3.1 power supply designed for high-end gaming and workstation PCs. 2. Despite its 1600 Watt output and numerous features, it targets budget-conscious users who need a powerful and efficient PSU. 3. The review will explore how Cooler Master manages to offer a competitive product with a more modest bill of materials.
- Intel to Launch "Lunar Lake" Core Ultra Chips on September 3rd1. Intel's next-generation Core Ultra laptop chips, codenamed Lunar Lake, are set to launch on September 3rd. 2. Lunar Lake is designed for ultrabooks and low-power mobile devices, featuring significant efficiency advancements. 3. The chips incorporate updated architectures, including Lion Cove and Skymont cores, Xe2 GPU, and 4th generation NPU, with both chiplets manufactured by TSMC.
July 28
- The AMD Ryzen AI 9 HX 370 Review: Unleashing Zen 5 and RDNA 3.5 Into Notebooks1. AMD introduces the Zen 5 microarchitecture and RDNA 3.5 graphics in their new mobile SoC, Strix Point. 2. The new SoC includes an upgraded XDNA 2-based NPU offering up to 50 TOPS of performance. 3. AMD's Ryzen AI 300 series targets the active notebook market, with the Ryzen AI 9 HX 370 featuring a mix of Zen 5 and Zen 5c cores.
July 27
- ASRock Launches Passively Cooled Radeon RX 7900 XTX & XT Cards for Servers1. ASRock introduces passively cooled Radeon RX 7900 XTX and XT cards for server use, addressing the high cost of official server cards. 2. These cards feature a dual-slot heatsink without fans, designed for high-airflow forced-air cooling, and are equipped with a 12V-2×6 power connector. 3. With 24GB and 20GB of memory respectively, these cards are targeted at memory-intensive AI applications, offering a cost-effective solution compared to high-end professional cards.
July 26
- SK hynix to Enter 60 TB SSD Club Next Quarter1. SK hynix plans to release a 60 TB SSD next quarter, entering the ultra-premium enterprise SSD market. 2. The company expects eSSD sales to quadruple compared to last year. 3. SK hynix has options to use its own or Solidigm's controllers for the new SSD.
July 25
- AMD Delays Ryzen 9000 Launch 1 to 2 Weeks Due to Chip Quality Issues1. AMD has delayed the launch of its Ryzen 9000 series desktop processors by one to two weeks due to quality issues with the initial production units. 2. The launch will now be staggered, with the Ryzen 5 9600X and Ryzen 7 9700X launching on August 8th, and the Ryzen 9 9900X and Ryzen 9 9950X on August 15th. 3. The delay is also due to AMD needing to recall and replace the first batch of chips sent to distributors.
- Micron Launches 9550 PCIe Gen5 SSDs: 14 GB/s with Massive Endurance1. Micron introduces the 9550 series SSDs, claiming they are the fastest enterprise drives with up to 14 GB/s read speeds. 2. The drives feature a PCIe 5.0 x4 interface and 232-layer 3D TLC NAND, available in various capacities and form factors. 3. Micron emphasizes the power efficiency of the 9550 SSDs, claiming up to 81% less energy per terabyte transferred compared to competitors.
July 24
- JEDEC Plans LPDDR6-Based CAMM, DDR5 MRDIMM Specifications1. JEDEC is developing standards for DDR5 MRDIMMs and LPDDR6-based CAMMs. 2. MRDIMMs aim to double peak bandwidth to 12.8 Gbps and support more than two ranks. 3. LPDDR6 CAMMs will feature a new connector array to accommodate wider memory bus requirements.
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