➀ Micron announces $200B U.S. investment plan spanning 20+ years, including $150B for six new DRAM fabs (2 in Idaho, 4 in New York) and $50B for domestic R&D;

➁ The first Idaho fab (ID1) will start DRAM production in late 2027, with HBM packaging capabilities added to Virginia facility post-domestic wafer scaling;

➂ While expanding U.S. capacity, Micron’s global DRAM/NAND production will remain predominantly overseas, reflecting strategic balancing of geopolitical demands and economic realities.

➀ Micron Technology introduces the world's first LPDDR5X memory using 1γ node technology, achieving 10.7 Gbps speed and 20% power savings;

➁ The ultra-thin 0.61mm package enables slimmer designs for smartphones and foldable devices, supporting on-device AI tasks like real-time translation and image generation;

➂ Performance tests show 30-50% faster AI responses compared to previous generations, with potential applications in AI PCs and automotive systems.

➀ Micron has commenced shipments of HBM4 memory, delivering 2.0TB/s per stack with a 2048-bit interface, a 60% performance boost over HBM3E;

➁ Initial 36GB stacks target next-gen AI accelerators, built on Micron's 1-beta process with advanced memory testing (MBIST) for reliability;

➂ Full production ramp is planned for 2026, aligning with next-gen AI hardware releases, while future designs may combine HBM with LPDDR for expanded memory capacity.

➀ Micron challenges court rulings that allowed YMTC access to 73 pages of confidential 3D NAND documentation, citing national security risks;

➁ The dispute stems from a 2023 patent infringement case where YMTC accused Micron, with Micron arguing YMTC's request for printed source code pages exceeds agreed limits;

➂ Under the protective order, YMTC's access is restricted to physical copies with strict anti-duplication rules, though Micron seeks Supreme Court intervention to revoke access entirely.

➀ Micron showcased a PCIe 6.0 SSD prototype (EVT3) at Computex 2025, achieving up to 30.25 GB/s speeds, though mass production remains distant;

➁ Astera Labs utilized the SSD to demo its PCIe 6.0 switch and software, highlighting peer-to-peer GPU-SSD communication for AI platforms;

➂ PCIe 6.0 certification delays until late 2025 mean interoperability testing is pending, with Micron's SSD still undergoing engineering validation phases (EVT3).

➀ This article lists the top ten semiconductor companies in 2024, based on data from Gartner.

➁ The top five companies are Nvidia, Samsung, Intel, Hynix, and Qualcomm.

➂ The full list includes other notable companies such as Broadcom, Micron, AMD, and MediaTek.

➀ The newly imposed U.S. import duties are likely to significantly increase the cost of storage devices due to their impact on HDD and SSD manufacturers.

➁ HDD manufacturers like Seagate, Toshiba, and Western Digital have complex supply chains with production in various countries, making them susceptible to high tariffs on Chinese-made drives.

➂ SSD manufacturers face challenges due to the 'country of origin' rules, potentially leading to increased costs if they are not assembled in countries exempt from tariffs.

➀ Micron confirms plans to raise memory prices due to strong demand for DRAM and NAND flash.

➁ The price hike is expected to continue through 2025 and 2026.

➂ Factors include supply constraints and growing demand from AI, data centers, and consumer electronics.

➀ Micron's SOCAMM memory is being used to power the next generation of NVIDIA Grace GB300 servers;

➁ The new SOCAMM memory form factor offers modular LPDDR5X memory for NVIDIA Grace CPUs;

➂ The modular design allows for easier upgrades and changes in memory configuration during the manufacturing process.

➀ Micron and SK hynix unveil new LPDDR5X SOCAMM memory modules;

➁ The modules are designed for AI and low-power servers, debuting on Nvidia GB300 systems;

➂ The memory offers high capacity, performance, and low power consumption.

➀ The CHIPS and Science Act, aimed at strengthening U.S. semiconductor manufacturing, is under threat of repeal by the Trump administration.

➁ The Act has already attracted nearly $450 billion in private investment from leading companies, raising concerns about the impact of its repeal on the U.S. chip market.

➂ Political hurdles and legal obligations make the repeal process complex and challenging.

➀ Micron and Astera Labs demonstrate the world's first PCIe 6.0 SSDs at DesignCon 2025;

➁ The SSD achieves read speeds of 27.14 GB/s with Astera's Scorpio PCIe 6.0 switch;

➂ PCIe 6.x promises to be the next horizon for enterprise and consumer products.

➀ The Q4 DRAM market grew 9.9%, reaching over $28 billion;

➁ Seasonal Q1 weakness and weakening CSP demand are expected to lower prices in the current quarter;

➂ Samsung remained the top DRAM supplier with $11.25 billion in revenue, followed by Hynix and Micron.

➀ TrendForce reports a 6.2% decline in Q4 NAND revenues, with ASPs falling 4% QoQ;

➁ Samsung's revenue fell 9.7% QoQ due to weak consumer electronics demand;

➂ Kioxia's Q4 revenue declined by only 0.2% QoQ due to enterprise SSD shipments;

➃ Micron's Q4 NAND Flash revenue dropped 9.3% QoQ despite strong enterprise SSD shipments.

➀ Micron is sampling its first Gen5 client SSD based on its G9 TLC NAND;

➁ The PCIe 4600 SSD offers sequential read speeds of 14.5 GB/s and write speeds of 12.0 GB/s;

➂ The SSD reduces load times by up to 62% compared to Gen4, enhancing energy efficiency by 107%.

Micron has launched its new 4600 series PCIe Gen5 NVMe SSD, designed for speed and capacity. The drive is targeted at OEM systems and offers impressive performance improvements over Gen4 NVMe SSDs. It features high-speed read and write speeds, and is available in capacities ranging from 512GB to 4TB.

With the 512GB model offering 10.3GB/s read and 5.8GB/s write speeds, and the 2TB model reaching 12GB/s write speeds, the 4600 series SSD is a significant leap in performance for client SSDs. It also demonstrates the capabilities of PCIe Gen5 in consumer-grade storage solutions.

Micron's move to release this series not through Crucial, but directly under its own brand, signifies its commitment to high-performance storage solutions for the OEM market.

➀ The article provides a quick look at Micron DDR5-5600 ECC UDIMM kits, highlighting their specifications and performance in newer platforms.

➁ The Micron DDR5-5600 ECC UDIMM modules are discussed, including their part number and physical appearance.

➂ The author mentions the pricing and availability of these modules, noting that they are currently expensive and not recommended for general use unless absolutely necessary.

➀ Intensifying competition from China, weak demand, and oversupply are forcing traditional NAND manufacturers like Samsung, Hynix, Kioxia, and Micron to cut production volumes, which may lead to industry consolidation in the long term.

➁ According to TrendForce, these companies are implementing production cuts by lowering utilization rates and delaying process upgrades.

➂ Since Q3 2024, prices have been declining, and H1 2025 demand appears weak, with Chinese producers aggressively expanding production.