➀ The Crucial 128GB DDR5-5600 SODIMM kit includes two 64GB SODIMMs, enabling 128GB of memory in mini PCs with dual SODIMM slots;

➁ The kit has been tested in systems like the Lenovo ThinkCentre M75q Tiny Gen5 and Acemagic F3A with AMD Ryzen AI 370 HX, as well as an upcoming Intel platform;

➂ The kit is expected to be featured in several systems over the next few months.

➀ The Crucial Pro Overclocking DDR5-6400 C38 offers excellent performance for both Intel and AMD CPUs.

➁ The memory kit supports Intel XMP 3.0 and AMD EXPO, and has a low-profile design.

➂ While the kit performs well in application workloads, its gaming performance is average, and it has limited overclocking capabilities.

➀ Tariffs have encouraged US memory buyers to get their orders in Q1, reducing inventories;

➁ DRAM prices expected to fall 0-5% QoQ in Q2, with HBM pricing to rise 3-8% due to HBM3e shipments;

➂ Samsung's HBM qualification progress slower than expected, but no significant capacity shift back to DRAM;

➃ SK hynix focusing on server and mobile DRAM, limiting PC DDR5 supply;

➄ DDR4 prices weak due to consumer demand and capacity expansion, with PC DRAM prices expected to remain flat QoQ in Q2;

➅ Server DRAM demand driven by top North American CSPs and AI server investment in China, with DDR5 prices expected to stabilise in Q2;

➆ Mobile DRAM demand improved, with LPDDR4X supply ample but prices expected to decline modestly;

➇ GDDR7 demand from next-gen graphics cards, with prices expected to hold flat or slightly down due to tight supply;

➈ GDDR6 prices expected to decline 3-8%, with suppliers bundling to stabilise pricing and clear inventory;

➉ Consumer DRAM seeing more aggressive purchasing, with DDR4 contract prices expected to rise 0-5% in 2Q25, and DDR3 prices likely to remain flat.

➀ Mini-PC manufacturer Minisforum has launched a new gaming motherboard, the BD790i X3D, featuring a mobile X3D chip.

➁ The board supports DDR5-5200 RAM up to 96GB and two M.2 2280 PCIe 5.0 x4 NVMe SSD for up to 4TB of storage.

➂ The BD790i X3D includes a PCIe 5.0 x16 slot for powerful desktop graphics cards and has an integrated Radeon 610M GPU for basic gaming needs.

➀ The ASRock Rack TURIN2D16-2T is designed to handle high-end server processors with dual AMD EPYC 9005 CPUs and sixteen DDR5 slots.

➁ It features an EEB form factor, providing ample space for the large SP5 CPU sockets and PCIe connectivity.

➂ Despite its size, it offers five PCIe x16 slots, with support for Gen4 and Gen5, and also CXL 2.0, making it a powerful server platform.

➀ The MSI B850 Tomahawk MAX Wifi offers a great value at $229.99 with dual PCIe 5.0 x4 sockets and 5 GbE, although it lacks a rear 20 Gbps port and integrated RGB.

➁ It features Wi-Fi 7, 5 GbE, and ample USB ports, including three Type-C ports.

➂ The board performs well in gaming and productivity apps, with a solid power delivery and a neutral design.

➀ The article provides a quick look at Micron DDR5-5600 ECC UDIMM kits, highlighting their specifications and performance in newer platforms.

➁ The Micron DDR5-5600 ECC UDIMM modules are discussed, including their part number and physical appearance.

➂ The author mentions the pricing and availability of these modules, noting that they are currently expensive and not recommended for general use unless absolutely necessary.

➀ Seco将在3月份的嵌入式世界展会上推出基于Intel Processor N系列的计算机模块；

➁ 这些处理器被称为Twin Lake，具有多达八个'Efficiency'核心，针对6至15W的功耗应用；

➂ SOM-SMARC-TWL具有SMARC（智能移动架构）外形尺寸，提供2x NBase-T、2x USB 3.2 Gen 2、6x USB 2.0和4x PCIe Gen 3通道等连接选项；

➃ SOM-COMe-CT6-TWL是类似处理器板，但采用COM Express Type 6 Compact外形尺寸。

➀ MSI has announced several Intel B860 motherboards in China, including the MAG B860 Tomahawk Wi-Fi, MAG B860M Mortar Wi-Fi, and Pro B860M-A Wi-Fi.

➁ These motherboards are optimized for ChangXin Memory Technology (CXMT) DDR5 memory ICs, which are the first locally produced DDR5 chips in China.

➂ CXMT uses a less advanced production node to stay within U.S. export restrictions, making its DDR5 chips larger but potentially advantageous due to lower import duties.

➀ China-based memory maker ChangXin Memory Technologies (CXMT) began shipping DDR5 memory chips, but their die size is 40% larger than Samsung's;
➁ The larger die size is due to the use of less advanced chipmaking technology;
➂ CXMT's 16 Gb DDR5 die size is comparable to first-generation DDR5 chips;
➃ CXMT's DDR5 costs are likely higher than Micron, Samsung, and SK hynix;
➄ The large die size indicates CXMT is years behind in process technology compared to competitors.