SK Hynix is planning to start mass production of HBM4E in 2026, a company research said.The South Korean memory maker originally planned to start mass production of the Gen 7 high-bandwidth memory (HBM) in 2027.But SK Hynix team leader and researcher Kwi Wook Kim said during International Memory Wee

SK Hynix expects to hit an accumulated revenue of mid-US$10 billion in high-bandwidth memory (HBM) sales by the end of 2024.The memory maker has already sold out its HBM capacity for the year as well as those for 2025, SK Hynix CEO Kwak Noh-jung said during a press conference on Thursday at the comp

SK Hynix is testing the performance of Tokyo Electron’s cryogenic etching equipment, TheElec has learned.The South Korean memory chipmaker has sent test wafers to the fab equipment maker for the tests instead of installing them in its own fab, sources said.Tokyo Electron’s new kit etches at high spe

SK Hynix has beat market estimates on its latest earnings on the back of rising prices of memory chip prices and strong sales of high-bandwidth memory (HBM).The South Korean chip giant said on Thursday that it recorded 12.42 trillion won in revenue and 2.88 trillion won in operating income in the fi

➀ Kioxia's IPO on the Tokyo Stock Exchange valued the company at $5.8 billion. The Bain-led consortium, which previously owned 56.2% of Kioxia, sold a small number of shares to reduce its holding to 50.7%. The consortium paid $18 billion for its stake in 2008. ➁ Before the IPO, other significant shareholders included Toshiba (41%) and Hoya (3%). The Japanese government bailout funds INCJ and DBJ controlled 16.7% of the voting rights. ➂ Kioxia holds a 13.8% share of the NAND market.

➀ Hynix is set to sample HBM3e 16hi memory in the first half of 2025; ➁ Lightsynq Technologies emerges with $18 million in Series A funding for diamond optical interconnects in quantum computing; ➂ DigiKey is optimistic about the future of the electronics market; ➃ Texas Instruments aims to increase in-house manufacturing to 95% by 2030.

➀ Hynix plans to start sampling HBM3e 16hi memory with 48 GB capacity per cube in H1 2025; ➁ HBM3e 16hi offers a high-capacity alternative before the production of HBM4 16hi; ➂ HBM3e 16hi can deliver a maximum capacity of 384 GB per system, surpassing NVIDIA’s Rubin at 288 GB; ➃ Transitioning from HBM3e to HBM4 will double the I/O count and increase die size, but the per-die capacity remains at 24 GB; ➄ HBM3e 16hi will adopt the Advanced MR-MUF stacking process for higher stack counts and computational bandwidth.

➀ The NAND ASP increased by 15% in Q2, leading to total revenue of $16.796 billion, a 14.2% increase q-o-q. ➁ All NAND Flash suppliers returned to profitability and are expanding capacity. ➂ Samsung's NAND ASP rose by 20%, while Hynix, Kioxia, Micron, and WDC also saw significant increases in ASP and revenue.

➀ The x86 architecture faces new challenges from Arm; ➁ SK Hynix is chasing after Samsung in the storage market; ➂ Taiwan's semiconductor industry is seeing its dominance in semiconductor manufacturing and packaging decline; ➃ The semiconductor industry is characterized by constant changes and innovation.

SK Hynix reportedly says 3D NAND chipmaking goes subzero as higher flash memory stacks must be produced at -70C temps.