➀ SK Hynix unveiled a UFS 4.1 storage solution using 321-layer 4D NAND flash, marking the industry's highest layer count;

➁ It delivers 4300MB/s read speed, 15%-40% faster random operations, 7% power efficiency improvement, and ultra-thin 0.85mm design for AI smartphones;

➂ The 1Tb TLC chip will expand to SSDs, strengthening SK Hynix's position as a full-stack AI memory provider.

➀ SEMI announced a 2% year-over-year growth forecast for front-end fab equipment spending in 2025, reaching $110 billion;

➁ This growth is driven by demand in HPC and memory sectors, as well as the increasing integration of AI;

➂ The Logic & Micro segment is expected to be a key driver of growth, with investments reaching $52 billion in 2025 and $59 billion in 2026.

➀ The Samsung 9100 Pro is Samsung's answer to the high-end PCIe 5.0 storage market, offering good performance and power efficiency.

➁ The drive is available in capacities up to 8TB and uses Samsung's 236-Layer V8 TLC flash memory.

➂ While not the fastest on the market, the 9100 Pro provides a solid and refined option for those seeking high-end storage.

➀ Longsys, a branded semiconductor memory enterprise, showcased a series of innovative storage products at MWC 2025.

➁ The PTM Business Model demonstrated Longsys' full-stack customization capabilities.

➂ Longsys presented a range of embedded storage solutions for mobile devices and server storage for AI computing.

➀ TrendForce reports a 6.2% decline in Q4 NAND revenues, with ASPs falling 4% QoQ;

➁ Samsung's revenue fell 9.7% QoQ due to weak consumer electronics demand;

➂ Kioxia's Q4 revenue declined by only 0.2% QoQ due to enterprise SSD shipments;

➃ Micron's Q4 NAND Flash revenue dropped 9.3% QoQ despite strong enterprise SSD shipments.

➀ NAND manufacturers are often overlooked in the AI boom despite their role in storage.

➁ The demand for DRAM, especially HBM, in AI computing far outstrips that for NAND, which is primarily used for secondary storage.

➂ The NAND market has experienced ups and downs, with a surge in demand for enterprise SSDs driven by AI servers and a decline in consumer demand.

➃ SanDisk's HBF technology offers a potential new direction for NAND, providing high bandwidth and capacity for AI inference applications.

➄ NAND manufacturers are exploring other avenues, such as increasing storage density and optimizing production capacity, to adapt to the AI market.

➀ The storage market, including NAND and DRAM, has been severely impacted since the third quarter of 2021, with DRAM prices falling by 57% and NAND prices by 55%;

➁ The market began to recover in the second half of 2023, driven by the rise of AI and the demand for HBM in AI chips;

➂ However, the warm season did not last long, and the storage market seems to be facing another winter at the beginning of 2025;

➃ NAND prices are expected to remain low in the first half of 2025, but SSD shipments are expected to increase in the second half due to growing demand for AI servers;

➄ DRAM prices are also expected to decline significantly in the first quarter of 2025, mainly due to weak consumer demand and excess supply of DDR4 memory modules;

➅ The DRAM industry is expected to shift its focus to DDR5 and HBM in the future, as these technologies are becoming increasingly important in data centers and AI applications.

➀ The Q1 NAND market remains over-supplied, leading to sustained price declines and financial strain for suppliers.

➁ Supply and demand are expected to be closer to balance in Q2, driven by production cuts, inventory reductions, and growing demand from AI and DeepSeek applications.

➂ China's trade-in subsidy policies have stimulated smartphone sales and accelerated depletion of NAND Flash inventory.

➀ Glasgow researchers have developed diamond transistors that default to off;

➁ Yangtze Memory Technologies is shipping a TLC NAND with 294 layers;

➂ The OECD reports on the retirement crisis facing many countries;

➃ Binder introduces Cat6A data cables with M12 connectors for railways;

➄ Intel adjusts its product roadmap with a 'get real' approach, delaying the 18A processor line.

➀ Yangtze Memory Technologies (YMTC) is shipping a TLC NAND with 294 layers, 232 of which are active;

➁ The new device has the same number of active layers as the company's previous generation NAND;

➂ The reason for the increase in dummy layers is unclear.

➀ DeepSeek AI项目开发者引起AI界的惊讶；

➁ 四大NAND厂商被迫削减产量；

➃ 欧洲分销组织FBDi主席Georg Steinberger突然去世；

➄ 欧洲分销组织FBDi主席Georg Steinberger突然去世；

➅ Infineon推出世界上最小的符合GSMA标准的e-SIM芯片；

➆ 石墨烯结构中的太赫兹波增强成像能力。

➀ Intensifying competition from China, weak demand, and oversupply are forcing traditional NAND manufacturers like Samsung, Hynix, Kioxia, and Micron to cut production volumes, which may lead to industry consolidation in the long term.

➁ According to TrendForce, these companies are implementing production cuts by lowering utilization rates and delaying process upgrades.

➂ Since Q3 2024, prices have been declining, and H1 2025 demand appears weak, with Chinese producers aggressively expanding production.

➀ Samsung Electronics and SK hynix are implementing a 'cost reduction' investment strategy in response to the NAND downturn.

➁ They are reducing production of legacy NAND while retrofitting older equipment to newer models.

➂ This approach aims to utilize idle capacity for 8th and 9th generation NAND production.

YEST has been in discussions with Japanese NAND giant Kioxia to supply high pressure annealing (HPA) equipment. According to a company spokesperson, the talks are aimed at providing HPA equipment for Kioxia's line expansion. YEST's equipment is capable of processing 125 wafers per action, compared to the rival's 75.