➀ Samsung will cease its multi-level cell (MLC) NAND flash memory production;
➁ Orders for MLC NAND chips will only be accepted until next month;
➂ The company informed a customer about price increases, prompting them to seek alternative suppliers.
Recent #NAND news in the semiconductor industry
YEST has been in discussions with Japanese NAND giant Kioxia to supply high pressure annealing (HPA) equipment. According to a company spokesperson, the talks are aimed at providing HPA equipment for Kioxia's line expansion. YEST's equipment is capable of processing 125 wafers per action, compared to the rival's 75.
➀ SK Hynix plans to reduce its NAND production output by 10% in the first half of the year; ➁ The company has a total monthly NAND production capacity of 300,000 wafers; ➂ NAND prices have been falling for four consecutive months due to oversupply.
➀ Micron reports revenue and EPS in line with expectations but provides weak guidance; ➁ AI-driven memory demand surges, while consumer memory struggles; ➂ Market concerns over Micron's stock due to the imbalance between AI and consumer memory growth.
➀ Samsung Electronics has developed a 400-layer NAND technology, surpassing SK hynix's 321-layer NAND; ➁ The 400-layer NAND will enter mass production in the second half of 2025; ➂ Samsung plans to provide details on its new 1Tb 400-layer TLC NAND at the ISSCC 2025.
➀ SK Hynix has commenced production of its 321-layer NAND chip; ➁ The chip features the highest number of layers in the industry; ➂ The product was first introduced at Flash Summit 2023 in August.
➀ Samsung is reportedly reducing its foundry and legacy DRAM production; ➁ The South Korean semiconductor giant is considering selling outdated NAND equipment in China; ➂ Local Chinese companies are said to be potential buyers.
➀ Samsung is reportedly planning to introduce 400-layer vertical NAND by 2026; ➁ The company aims to reach a 1,000-layer NAND target by 2030; ➂ This move is part of the competition in the memory market, especially with HBM becoming a crucial battlefield in the AI era.
➀ Contract prices of DRAM and NAND dropped by over 10% in September; ➁ The decline was due to low demand for PCs and consumer electronics; ➂ DDR4 8Gb 1Gx8 prices fell by 17.07% to US$1.7.
➀ Kioxia showcased its BiCS 8 3D NAND technology at FMS 2024, featuring 218 layers and a new CMOS Bonded Array (CBA) process. ➁ The CBA process allows independent parallel processing of CMOS wafer and cell array wafer, improving reliability and performance. ➂ Despite fewer layers compared to competitors, Kioxia's lateral scaling enables competitive bit density and operating speeds.
1. Micron has started shipping its 9th Generation 276-layer TLC NAND, offering significant improvements in density and performance. 2. The new NAND features a 44% increase in density over the previous generation and supports transfer rates up to 3600 MT/sec. 3. Micron's 2650 client SSD is the first product to utilize this new NAND technology, providing high-speed storage solutions for various applications.
1. Kioxia introduces 1 Tb and 2 Tb 3D QLC NAND devices with a 3600 MT/s interface speed. 2. The new NAND devices feature 238 active layers and CMOS directly Bonded to Array (CBA) design. 3. Kioxia's 2 Tb 3D QLC NAND offers 70% higher write power efficiency and is suitable for AI and large storage applications.
1. Kioxia is sampling 2 terabit NAND chips with a QLC design and BiCS 8 218-layer architecture. 2. The new chip offers higher bit density and power efficiency compared to previous generations. 3. Pure Storage plans to use these chips to enhance their all-flash storage solutions.
SK Hynix is testing the performance of Tokyo Electron’s cryogenic etching equipment, TheElec has learned.The South Korean memory chipmaker has sent test wafers to the fab equipment maker for the tests instead of installing them in its own fab, sources said.Tokyo Electron’s new kit etches at high spe
➀ SEMI announced a 2% year-over-year growth forecast for front-end fab equipment spending in 2025, reaching $110 billion;
➁ This growth is driven by demand in HPC and memory sectors, as well as the increasing integration of AI;
➂ The Logic & Micro segment is expected to be a key driver of growth, with investments reaching $52 billion in 2025 and $59 billion in 2026.
➀ The Samsung 9100 Pro is Samsung's answer to the high-end PCIe 5.0 storage market, offering good performance and power efficiency.
➁ The drive is available in capacities up to 8TB and uses Samsung's 236-Layer V8 TLC flash memory.
➂ While not the fastest on the market, the 9100 Pro provides a solid and refined option for those seeking high-end storage.
➀ Longsys, a branded semiconductor memory enterprise, showcased a series of innovative storage products at MWC 2025.
➁ The PTM Business Model demonstrated Longsys' full-stack customization capabilities.
➂ Longsys presented a range of embedded storage solutions for mobile devices and server storage for AI computing.
➀ TrendForce reports a 6.2% decline in Q4 NAND revenues, with ASPs falling 4% QoQ;
➁ Samsung's revenue fell 9.7% QoQ due to weak consumer electronics demand;
➂ Kioxia's Q4 revenue declined by only 0.2% QoQ due to enterprise SSD shipments;
➃ Micron's Q4 NAND Flash revenue dropped 9.3% QoQ despite strong enterprise SSD shipments.
➀ NAND manufacturers are often overlooked in the AI boom despite their role in storage.
➁ The demand for DRAM, especially HBM, in AI computing far outstrips that for NAND, which is primarily used for secondary storage.
➂ The NAND market has experienced ups and downs, with a surge in demand for enterprise SSDs driven by AI servers and a decline in consumer demand.
➃ SanDisk's HBF technology offers a potential new direction for NAND, providing high bandwidth and capacity for AI inference applications.
➄ NAND manufacturers are exploring other avenues, such as increasing storage density and optimizing production capacity, to adapt to the AI market.
➀ The storage market, including NAND and DRAM, has been severely impacted since the third quarter of 2021, with DRAM prices falling by 57% and NAND prices by 55%;
➁ The market began to recover in the second half of 2023, driven by the rise of AI and the demand for HBM in AI chips;
➂ However, the warm season did not last long, and the storage market seems to be facing another winter at the beginning of 2025;
➃ NAND prices are expected to remain low in the first half of 2025, but SSD shipments are expected to increase in the second half due to growing demand for AI servers;
➄ DRAM prices are also expected to decline significantly in the first quarter of 2025, mainly due to weak consumer demand and excess supply of DDR4 memory modules;
➅ The DRAM industry is expected to shift its focus to DDR5 and HBM in the future, as these technologies are becoming increasingly important in data centers and AI applications.
Page 1 of 2 pagesNext