➀ SK Hynix has commenced production of its 321-layer NAND chip; ➁ The chip features the highest number of layers in the industry; ➂ The product was first introduced at Flash Summit 2023 in August.
Related Articles
- SK Hynix to reduce NAND production by 10% within 1st half of year5 months ago
- 2% 2025 growth forecast for front-end fab equipment2 months ago
- SK Hynix to install equipment 2 months faster in new M15X fab2 months ago
- Hanwha Semitech to supply 14 TC bonders to SK Hynix for HBM3 months ago
- The Last of Us challenged the views of Nintendo's Miyamoto and God of War's Jaffe3 months ago
- Death Stranding 2 pre-orders 'are about to open' - physical edition details leaked3 months ago
- CEO Interview with Pradyumna (Prady) Gupta of Infinita Lab3 months ago
- Bug Hunting in Multi Core Processors. Innovation in Verification3 months ago
- Kioxia's new 10th gen 332-layer 4.8 GB/s 3D NAND flash is 33% faster than its 8th gen ICs3 months ago
- Webinar: RF design success hinges on enhanced models and accurate simulation3 months ago