1. The semiconductor industry is grappling with severe supply chain disruptions caused by the global chip shortage; 2. Key sectors like automotive and electronics face production delays due to component scarcity; 3. Companies are adopting strategies including supplier diversification and capacity expansion to mitigate risks.

1. The semiconductor industry is grappling with severe supply chain disruptions due to COVID-19, geopolitical tensions, and surging demand; 2. Global chip shortages have caused production delays and price hikes in automotive, consumer electronics, and industrial sectors; 3. Industry leaders urge governments and stakeholders to invest in domestic manufacturing and collaborative solutions to address long-term challenges.

➀ Nintendo aims to maximize Switch 2 sales, potentially reaching 20 million units in the first year; ➁ Despite robust production, supply constraints due to high demand are predicted; ➂ Analysts predict the Switch 2 could sell 4.3 million units in the U.S. in 2025, with total sales possibly reaching 80 million by 2028.

➀ Major tech companies have significantly increased capital expenditures in recent years to acquire AI chips and build data centers. ➁ Global investment in data centers has recently slowed, raising concerns about the sustainability of the AI boom. ➂ AI phones may sustain the chip industry amid the decline in data center investment.

➀ NVIDIA and AMD are shipping their latest GeForce RTX 50 and Radeon RX 9000 GPUs to the US before the new tariffs on January 20, 2025. ➁ Both companies will showcase their new GPUs at CES 2025. ➃ NVIDIA plans to release multiple RTX 50 series models, while AMD introduces the RDNA 4 architecture.

➀ NVIDIA's GB200 AI servers face supply chain delays; ➁ Mass production may be delayed until Q2 or Q3 2025 due to high design specifications; ➂ The GB200 NVL72 model requires advanced NVLink connectivity and high TDP, prompting a shift towards liquid cooling solutions.

➀ Samsung has not yet passed NVIDIA's qualification for HBM3E memory; ➁ The delay is due to Samsung's inability to meet NVIDIA's chip performance requirements; ➂ It is 'realistically impossible' for Samsung to supply HBM3E to NVIDIA this year.

➀ The departure of CEO Pat Gelsinger highlights ongoing issues at Intel; ➁ Semiconductor technology and supply chain control are crucial in the AI era; ➂ Intel's board of directors has made a series of poor decisions over the past two decades.

➀ The modern automotive market's disruptions are affecting the supply chain, particularly Tier1 suppliers. ➁ The integration of AI in automotive systems is leading to more unified supplier platforms. ➃ DENSO's acquisition of Quadric's GPNPU license and co-development of in-vehicle semiconductors is a significant step in the semiconductor design game for DENSO.

➀ ASML experienced a global IT outage disrupting its operations; ➁ The outage affected clean rooms and communication with suppliers; ➂ ASML is crucial for companies like TSMC and Intel.

➀ Quanta Computer plans to increase AI server production in the US due to high demand; ➁ NVIDIA's GB200 is being trial-produced in Taiwan and the US, with production ramping up in Q1 2025; ➂ Quanta has production capacity on both the east and west coasts of the United States and will continue to expand its factories.

➀ TSMC has reportedly stopped shipments to at least two chip developers; ➁ The move is suspected to be due to their attempts to bypass U.S. export restrictions; ➂ Bitmain's supply is reportedly at risk due to this action.

1. Samsung's HBM3E memory chips have been qualified by NVIDIA for AI GPUs. 2. Up to 30% of DRAM production capacity will be allocated for HBM3E, leading to a potential DRAM price increase. 3. Samsung's qualification is expected to alleviate the HBM memory shortage and support AI industry development.

1. TSMC's 3nm supply exceeds demand, with major US tech companies like AMD, Apple, NVIDIA, Qualcomm, and others fully utilizing production capacity with orders expected to continue through 2026. 2. TSMC plans to increase 3nm OEM prices by more than 5%, and the annual quotation for advanced packaging in 2026 is also expected to rise by 10-20%. 3. TSMC's stock price has reached a record high, and the company is investing in advanced processing and packaging technologies, expecting a 'double success'. 4. The Zhunan Advanced Packaging Factory (AP6) has been operational for a year, and with the arrival of new AP6C machines, it has become Taiwan's largest CoWoS advanced packaging facility. 5. In 2024, TSMC's monthly CoWoS production capacity is expected to nearly double, from 17,000 to 33,000 pieces. 6. Advanced packaging production is in high demand, with NVIDIA accounting for about half of the capacity, followed by AMD, Broadcom, Amazon, and Marvell. 7. NVIDIA, with a gross profit margin close to 80%, is unlikely to give up newly opened advanced packaging production capacity and will adopt a price increase and profit-sharing strategy. 8. TSMC's additional CoWoS-related equipment is expected to be in place in Q3 2024, requiring more engineers at various factories. 9. Prices for advanced processes, including 3nm and 5nm, will also be adjusted, with strong 3nm orders in the second half of the year and high utilization rates extending into 2025. 10. The shortage of advanced packaging production capacity is expected to continue into 2025, with a projected production of over 600,000 pieces, and TSMC's supply for next year estimated at 530,000 pieces, indicating a gap of around 70,000 pieces.