1. TSMC's 3nm supply exceeds demand, with major US tech companies like AMD, Apple, NVIDIA, Qualcomm, and others fully utilizing production capacity with orders expected to continue through 2026. 2. TSMC plans to increase 3nm OEM prices by more than 5%, and the annual quotation for advanced packaging in 2026 is also expected to rise by 10-20%. 3. TSMC's stock price has reached a record high, and the company is investing in advanced processing and packaging technologies, expecting a 'double success'. 4. The Zhunan Advanced Packaging Factory (AP6) has been operational for a year, and with the arrival of new AP6C machines, it has become Taiwan's largest CoWoS advanced packaging facility. 5. In 2024, TSMC's monthly CoWoS production capacity is expected to nearly double, from 17,000 to 33,000 pieces. 6. Advanced packaging production is in high demand, with NVIDIA accounting for about half of the capacity, followed by AMD, Broadcom, Amazon, and Marvell. 7. NVIDIA, with a gross profit margin close to 80%, is unlikely to give up newly opened advanced packaging production capacity and will adopt a price increase and profit-sharing strategy. 8. TSMC's additional CoWoS-related equipment is expected to be in place in Q3 2024, requiring more engineers at various factories. 9. Prices for advanced processes, including 3nm and 5nm, will also be adjusted, with strong 3nm orders in the second half of the year and high utilization rates extending into 2025. 10. The shortage of advanced packaging production capacity is expected to continue into 2025, with a projected production of over 600,000 pieces, and TSMC's supply for next year estimated at 530,000 pieces, indicating a gap of around 70,000 pieces.