Recent #Chip news in the semiconductor industry

7 months ago
➀ Softbank plans to challenge Nvidia with its Izanagi AI processor project, which could attract an investment of $100 billion; ➁ Prototypes of the Izanagi processors are expected in summer 2025, with mass production set for 2026; ➂ Arm and Graphcore are central to the chip design, with Arm aiming to move up the value chain; ➃ The involvement of hyperscalers could raise the funding to hundreds of billions; ➄ Softbank CEO Masayoshi Son has discussed the project with OpenAI and made a tender offer to OpenAI employees.
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8 months ago

➀ Enfabrica Corp., a promising startup, has raised $125 million in B轮融资 and attracted investment from AI giant NVIDIA, which is considered a competitor due to its AI network chip development that may challenge NVIDIA's Mellanox solutions.

➁ The company has recently completed its C轮融资, securing $115 million from heavyweights like Arm, Cisco, and Samsung.

➂ Enfabrica has developed its AI network interconnect chip, ACF-S, to address GPU network pain points and memory and storage expansion challenges.

➃ The company's ACF-S chip integrates CXL/PCIe switching and RNIC functions into a single device, eliminating the need for PCIe switches, NICs, or independent CPU connections to DRAM.

➄ Enfabrica's Millennium chip, announced at SC24, offers multi-port 800 GbE connectivity for GPU servers and provides unparalleled performance, scale, and elasticity for AI clusters.

➅ The company believes its interconnect technology will become the core of future GPU computing networks.

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9 months ago
➀ Huawei's upcoming Mate 70 series phones are expected to be powered by the Kirin 9100 chip, rumored to be priced between 1100 to 1300 yuan; ➁ The Kirin 9100 may outperform Qualcomm's Snapdragon 8 Gen 2 in performance; ➂ Despite potential yield and production cost issues with 5nm DUV lithography, the chip is expected to have a similar price range to flagship processors from Qualcomm and MediaTek.
ChipHuawei
10 months ago
➀ Huawei is working on improving power consumption efficiency for its upcoming Kirin 9 chip; ➁ The new chip is expected to have more stable and efficient small cores compared to previous versions; ➂ Huawei plans to use new self-developed small cores for better power efficiency; ➃ The architecture of medium and large cores is expected to remain unchanged; ➄ The new Kirin 9 chip could be used in devices like the Nova 13 series or Mate 70 series.
ChipHuaweienergy
11 months ago
➀ Snapdragon 8 Gen 4 is rumored to focus on energy efficiency rather than raw CPU performance. ➁ The chip is expected to come in two variants: SM8750 (standard) and SM8750P (performance). ➂ It will be built using TSMC’s 3nm process, aiming to reduce power consumption and extend battery life. ➃ The chip will feature Qualcomm’s custom Oryon CPU cores and AI-focused upgrades, including a Low-Power Artificial Intelligence subsystem.
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