1. Samsung's HBM3E memory chips have been qualified by NVIDIA for AI GPUs. 2. Up to 30% of DRAM production capacity will be allocated for HBM3E, leading to a potential DRAM price increase. 3. Samsung's qualification is expected to alleviate the HBM memory shortage and support AI industry development.
Recent #Memory Chips news in the semiconductor industry
➀ Yangtze Memory Technologies (YMTC) is shipping a TLC NAND with 294 layers, 232 of which are active;
➁ The new device has the same number of active layers as the company's previous generation NAND;
➂ The reason for the increase in dummy layers is unclear.
➀ China-based memory maker ChangXin Memory Technologies (CXMT) began shipping DDR5 memory chips, but their die size is 40% larger than Samsung's;
➁ The larger die size is due to the use of less advanced chipmaking technology;
➂ CXMT's 16 Gb DDR5 die size is comparable to first-generation DDR5 chips;
➃ CXMT's DDR5 costs are likely higher than Micron, Samsung, and SK hynix;
➄ The large die size indicates CXMT is years behind in process technology compared to competitors.
➀ TSMC's HBM4 memory launch brings significant changes, with the most noticeable being the expansion of memory interfaces from 1024 to 2048 bits;
➁ TSMC revealed details about base die for HBM4 manufacturing using improved versions of its N12 and N5 processes at the 2024 European Technology Symposium;
➂ TSMC plans to adopt two different manufacturing processes, N12FFC+ and N5, for the first batch of HBM4 product packaging;
➃ TSMC is working with major HBM memory suppliers like Micron, Samsung, and SK Hynix to integrate HBM4 memory technology using advanced process nodes;
➄ TSMC's N12FFC+ process is suitable for achieving HBM4 performance, allowing memory manufacturers to build 12-Hi (48GB) and 16-Hi (64GB) stacks with over 2TB/s bandwidth;
➅ TSMC's N5 process will integrate more logic functions, reduce power consumption, and provide higher performance with very small interconnect spacing, enabling HBM4 direct 3D stacking on logic chips.
1. Micron's earnings report alleviated concerns over oversupply; 2. The AI growth trend may sustain Micron's current upcycle; 3. Micron is focusing on higher-value segments to boost profitability; 4. Despite potential oversupply risks, Micron's bullish thesis remains sustainable; 5. Investors should consider buying into Micron's recent recovery.
➀ HBM memory chips are becoming crucial for AI applications, especially for large language models like ChatGPT. ➁ SK Hynix and Samsung are leading the development and supply of HBM devices, with SK Hynix having a significant advantage. ➂ SK Hynix plans to develop HBM4, which will integrate memory directly onto processors, revolutionizing chip design and manufacturing.