Recent #energy efficiency news in the semiconductor industry
➀ The EU will enforce a new energy label for smartphones and tablets (Android/iPadOS) from June 20, 2025, evaluating energy efficiency, durability, repairability, and reliability, with Fraunhofer IZM contributing key technical standards;
➁ The label aims to extend device lifespans (3.0 to 4.1 years for midrange phones), reduce e-waste, and save consumers €20 billion by 2030 through requirements like 800+ battery cycles, 7-year spare parts availability, and software/firmware access;
➂ Fraunhofer IZM developed robustness tests (e.g., drop tests) and advocated for reparability metrics, with similar laptop labels planned for 2028.
➀ The student team Lausitz Dynamics from Brandenburgische Technische Universität (BTU) is participating in the Shell Eco-marathon Europe and Africa 2025 in Poland with their hydrogen fuel cell vehicle, Hydragen, aiming for maximum energy efficiency.
➁ The team of 17 students, led by Prof. Sylvio Simon, redesigned the vehicle to use a hydrogen fuel cell and supercapacitors, enhancing performance and sustainability.
➂ Supported by sponsors and successful test drives, the team is optimistic about the competition, with live results and updates shared on their website and social media.
➀ Researchers at Penn State have developed a novel solid-state electrolyte (SSE) using cold sintering, which enables safer and higher performance solid-state batteries.
➁ The newly developed ceramic-polymer composite SSE combines the stability of ceramic LATP with the conductivity of poly-ionic liquid gel (PILG), reducing ion transport obstacles.
➂ This breakthrough could transform energy storage across various industries, including smartphones and electric vehicles, with potential further applications in semiconductor manufacturing and ceramics processing.
➀ The Fraunhofer Institute for Photonics Microsystems (IPMS) has achieved a milestone in chemical liquid analysis with the miniaturization of electronics required for ion-sensitive field-effect transistors (ISFETs).;
➁ The new electronics have been made more energy-efficient and have reduced manufacturing costs, making them suitable for direct use or integration into custom measurement systems.;
➂ The ISFETs enable continuous and precise measurement of pH values by determining the concentration of specific ions in water or other aqueous media in real-time.
➀ Photonic computing chips, which combine light and electricity, have been proven to enhance computing performance while reducing energy consumption compared to traditional electronic chips.
➁ Two recent studies demonstrated the capabilities of integrated photonic and electronic chips in performing key AI operations like multiplication and accumulation more efficiently.
➂ A large-scale photonic accelerator and another processor showed promising results in solving complex computational tasks and executing AI models such as BERT and ResNet with high accuracy.
➀ Onsemi推出首款基于1200V碳化硅(SiC)MOSFET的SPM 31智能电源模块(IPMs),提供更高的能效和功率密度,同时减小了体积。
➁ 这些模块适用于多种工业系统,如AI数据中心的EC风扇、热泵、HVAC系统、伺服电机、变频驱动器(VFD)以及工业泵和风扇,可显著降低能耗和成本。
➂ SPM 31 IPMs具有低损耗、内置低压保护、统一PCB设计支持不同电流选项等特点,有助于减少开发时间并提高整体系统安全性。
➀ A research team at the Helmholtz-Zentrum Dresden-Rossendorf (HZDR) has developed an e-skin that detects and tracks magnetic fields with high precision.
➁ The technology is designed to be light, transparent, and permeable, mimicking the human skin's interactions with the brain.
➂ The e-skin uses a magnetosensitive layer as a global sensor to localize magnetic signals and is capable of reconstructing signals similar to how the human brain processes touch.
➀ AI正逐渐向边缘迁移,这是好事;
➁ 设计师必须为巨大的电力需求做好准备;
➂ 准备合适的硬件和策略以优化效率。
Researchers at Saarland University in Germany are developing a novel elastocaloric cooling and heating technology that uses shape memory nickel-titanium alloy. This technology is more energy-efficient and environmentally friendly than traditional methods. The research team is working on prototypes for use in vehicles, with the goal of commercialization within five years.
The technology is recognized by the EU Commission as a promising alternative to conventional heating and cooling systems, and has received significant funding. The team is collaborating with industry partners to develop practical solutions for cooling electric vehicles and residential buildings.
The prototypes being developed are based on the unique shape memory properties of nickel-titanium, which can absorb and dissipate heat during phase changes. The technology has the potential to address global energy challenges and reduce carbon emissions.
➀ The University of Saarland's research team, led by Professors Stefan Seelecke and Paul Motzki, has developed a new climate technology that is more energy-efficient and sustainable than current methods.
➁ The technology, called Elastocaloric, uses thin wires and sheets made of nickel-titanium to transport heat through deformation.
➂ The team is working on prototypes for vehicles and aims to have the technology ready for practical use within five years.
➀ A research team in Saarland, Germany is developing miniaturized pumps and valves using dielectric elastomeric silicone films, which are lightweight, compact, and energy-efficient.
➁ These devices operate without compressed air, motors, or lubricants and are suitable for cleanroom environments.
➂ The technology is scalable and can be used in various applications, including automotive, medical, pharmaceutical, and industrial processing.
➀ A new type of robot technology in Saarland reduces energy consumption by 90% compared to conventional systems.
➁ The technology uses lightweight, shape memory materials to create non-pneumatic gripper systems that operate without additional sensors.
➂ The prototypes on display at Hannover Messe include vacuum and jaw grippers that require minimal energy to hold and manipulate workpieces.
➀ Silicon carbide (SiC) offers significant technical advantages for power electronics, but its cost remains a barrier to market penetration. The Fraunhofer Institutes are developing key technologies to reduce material losses and device thickness while increasing the thermomechanical stability of SiC chips.
➁ The ThinSiCPower project aims to produce cost-effective SiC substrates and thinner SiC chips using more resource-efficient processing technologies, such as laser separation of SiC crystals and bonding onto a carrier substrate.
➂ The project partners are Fraunhofer ISE, ENAS, IWM, and IISB, with the goal of reducing SiC device costs by 25% and SiC design costs by 25% through increased load cycle stability.
➀ The Baelz Foundation has for the 22nd time awarded outstanding Bachelor's and Master's theses;
➁ Johannes Spangler, a graduate of HBC, received the second prize in the Master's category;
➂ Spangler's thesis focused on the analysis and evaluation of refrigeration systems using new software tools.
➀ The Fraunhofer FEP is developing optically effective surface structures for perovskite solar cells within the EU PERSEUS project to enhance cell efficiency and reduce reflection losses.
➁ The Design-PV project focuses on creating decorative surfaces for integrated photovoltaic modules, combining aesthetically pleasing solutions with PV-active wall areas.
➂ The RzR-NIL technology allows for the production of large-area, continuous film surfaces with various applications, such as Lab-on-Chip structures, biofouling reduction, and window anti-reflective coatings.
➀ The Fraunhofer Heinrich-Hertz-Institut (HHI) has started the CELTIC-NEXT Flagship Project SUSTAINET aimed at developing sustainable and resilient network technologies.
➁ The project, funded by the Federal Ministry of Education and Research with 30 million Euros, will run from January 2025 to December 2027.
➂ The focus is on developing future-proof networks that integrate fiber, wireless networks, and modern mobile generations, improving the availability, resilience, and sustainability of the networks.
Fraunhofer Heinrich-Hertz-Institut (HHI) has initiated the SUSTAINET project, a €30 million research effort to develop sustainable and resilient network technologies. The project, running from January 2025 to December 2027, aims to integrate fiber optics, radio, and mobile networks to improve network availability and sustainability. It is divided into three sub-projects focusing on advanced technologies, intelligent solutions, and sustainable network architectures.