1. Researchers at EFPL developed a 2D quantum cooling system capable of reaching 100 millikelvins. 2. The system converts heat into electrical voltage, crucial for quantum computing. 3. The technology uses the Nernst effect and a combination of graphene and 2D-thin structures for efficiency.
Recent #Cooling Technology news in the semiconductor industry
1. ASRock rebrands its Radeon 7900 WS series to the Creator Series. 2. Features include a blower-style cooler and a newer 12V-2x6 power connector. 3. Designed for multi-GPU clusters, AI inference, generative AI, and professional workstation use.
1. GIGABYTE introduces the GeForce RTX 4070 Ti SUPER with a hidden 16-pin power connector. 2. Features a new WINDFORCE MAX cooling system for enhanced performance. 3. The card includes factory overclocking, boosting the GPU up to 2655MHz.
➀ The University of Saarland's research team, led by Professors Stefan Seelecke and Paul Motzki, has developed a new climate technology that is more energy-efficient and sustainable than current methods.
➁ The technology, called Elastocaloric, uses thin wires and sheets made of nickel-titanium to transport heat through deformation.
➂ The team is working on prototypes for vehicles and aims to have the technology ready for practical use within five years.
➀ As lithium-ion batteries become more compact, cooling technologies are vital for safety and efficiency;
➁ The increasing use of li-ion batteries in domestic appliances demands improved cooling techniques;
➂ Innovations in cooling technologies can enhance battery performance, lifespan, and safety.
1. Vertiv is guiding a strong outlook for eFY25 with accelerated top-line growth paired with improved margins; 2. The company's strong backlog, partnerships, and expansion in liquid cooling and modular solutions position it for robust growth; 3. Management forecasts global data center footprint to grow at a 24% CAGR through 2028.
➀ Microsoft's Zaid Kahn, the vice president of Cloud AI and Advanced Systems, discussed the challenges faced when expanding AI clusters to tens of thousands of accelerators and larger scales at the AI Hardware Summit.
➁ He believes that the next generation of systems requires new system architectures, vertical power transmission, interconnect innovations, and new advanced cooling technologies.
➃ Microsoft has increased its supercomputing capabilities by over 30 times in the past six months.
➀ xMEMS Labs introduces the XMC-2400 µCooling chip, the first silicon MEMS active cooling fan for ultramobile devices and AI solutions. ➁ The XMC-2400 is a 1 mm thick, silent, vibration-free, solid-state cooling solution that can be integrated into smartphones and tablets. ➂ The chip is 96% smaller and lighter than non-silicon active coolers, with a capability to move 39 cubic centimeters of air per second under 1000 Pa back pressure.
1. Adata introduces the Legend 970 Pro PCIe Gen5 SSD with read speeds up to 14GB/s and write speeds up to 11GB/s. 2. The SSD features a built-in fan and double-layered aluminium heatsink for enhanced cooling. 3. It supports backward compatibility with PCIe 4.0 and 3.0 systems and includes advanced data protection features.