<p>➀ Microsoft's Zaid Kahn, the vice president of Cloud AI and Advanced Systems, discussed the challenges faced when expanding AI clusters to tens of thousands of accelerators and larger scales at the AI Hardware Summit.</p><p>➁ He believes that the next generation of systems requires new system architectures, vertical power transmission, interconnect innovations, and new advanced cooling technologies.</p><p>➃ Microsoft has increased its supercomputing capabilities by over 30 times in the past six months.</p>
Related Articles
- Hannover Messe: New Climate Technology for Home, Car, and Industry – How Wires and Sheets Cool and Heat Sustainably2 months ago
- Viewpoint: Could novel cooling technologies unlock the hidden potential of domestic batteries?3 months ago
- Vertiv: AI Factory Construction Is Accelerating Top-Line Growth4 months ago
- Silicon 'Fan-on-a-Chip' for Active Cooling in Mobile Devices9 months ago
- Adata introduces the Legend 970 Pro PCIe 5.0 M.2 SSD with up to 14GB/s read speeds10 months ago
- 2D quantum cooling system: temps colder than outer space, converts heat into electrical voltage11 months ago
- ASRock's new Radeon RX 7900 Creator Series GPU features 12V-2x6 power connector, blower cooler11 months ago
- GIGABYTE's new GeForce RTX 4070 Ti SUPER: hidden 16-pin connector, WINDFORCE MAX cooler11 months ago