➀ The webinar discusses the impact of generative AI on technology evolution and the rise in compute power demand.

➁ It covers the trends in larger compute chips, multi-die systems, advanced packaging, and memory architectures.

➂ Key technologies like die-to-die communication, custom HBMs, and 3D stacking are explored in detail.

➀ JEDEC and OCP announce new Chiplet Design Kits for EDA use;

➁ The kits cover Assembly, Substrate, Material, and Test;

➂ The kits aim to automate SiP design and build using chiplets.

➀ CAST, a leading provider of silicon IP solutions, and Shikino High-Tech Co., Ltd., a Japanese company specializing in semiconductor design, imaging, sensing, and testing technologies, have announced a strategic partnership.

➁ The partnership aims to expand both companies’ reach and offerings in the global semiconductor market.

➂ The collaboration is focused on enhancing the availability of silicon IP offerings.

➀ Silicon Creations successfully tape-outs a chip on the TSMC N2P process;

➁ The chip includes a novel temperature sensor design;

➂ The expanded portfolio of clocking IP supports next-generation semiconductor products.