Recent #3D-IC news in the semiconductor industry

11 months ago
1. Siemens Digital Industries Software and Intel Foundry have certified Solido EDA software for Intel's 16 and 18A nodes. 2. The collaboration enables an embedded multi-die interconnect bridge (EMIB) for faster 3D-IC design implementation. 3. Intel 18A features RibbonFET GAA transistor architecture and PowerVia backside power delivery technologies, supported by Siemens' Solido Simulation Suite.
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