Recent #3D-IC news in the semiconductor industry

about 1 year ago
1. Siemens Digital Industries Software and Intel Foundry have certified Solido EDA software for Intel's 16 and 18A nodes. 2. The collaboration enables an embedded multi-die interconnect bridge (EMIB) for faster 3D-IC design implementation. 3. Intel 18A features RibbonFET GAA transistor architecture and PowerVia backside power delivery technologies, supported by Siemens' Solido Simulation Suite.
3D-ICIntelSiemens EDA