➀ Cadence推出一系列关于汽车设计趋势和挑战的网络研讨会;➁ 预计汽车半导体市场到2029年将以11%的复合年增长率增长;➂ 汽车OEM和一级供应商正朝着垂直整合的趋势发展。
Recent #3D-IC news in the semiconductor industry
1. Siemens Digital Industries Software and Intel Foundry have certified Solido EDA software for Intel's 16 and 18A nodes. 2. The collaboration enables an embedded multi-die interconnect bridge (EMIB) for faster 3D-IC design implementation. 3. Intel 18A features RibbonFET GAA transistor architecture and PowerVia backside power delivery technologies, supported by Siemens' Solido Simulation Suite.