1. Siemens EDA introduces Calibre 3DThermal, a new tool for early thermal analysis in chiplet and 3D IC designs. 2. The tool enables efficient shift-left analysis and verification, allowing teams to start thermal analysis early in the design process. 3. Calibre 3DThermal integrates with existing Siemens EDA tools and supports multi-physics analysis, aiding in meeting thermal, power, and timing goals.
Related Articles
- What caught your eye? (Excellion, AI ICs, Power op-amp, Nuclear batteries)4 months ago
- Questa One software uses AI to verify complex chip design4 months ago
- What caught your eye? (Siemens Digital, Compound semis, 3D magnetic sensor)5 months ago
- PAVE360 SDV tech available on AMD CPUs and GPUs on Azure6 months ago
- Unlocking the cloud: A new era for post-tapeout flow for semiconductor manufacturing6 months ago
- Innexis Product Suite: Driving Shift Left in IC Design and Systems Development9 months ago
- Solido SPICE certified for Samsung Foundry’s latest processes9 months ago
- Prioritize Short Isolation for Faster SoC Verification11 months ago
- Siemens Tech Day: Video Interview – Smart challenges facing automotive industry11 months ago
- Siemens Tech Day: Video Interview – Academia’s role in automotive security11 months ago