➀ TSMC will start producing 2nm GAA-based wafers in Q4 2025 at Fab 20 in Hsinchu; ➁ The production will be followed by Fab 22 in Kaohsiung in Q1 2026; ➂ N2P production will start in late 2026 without backside power delivery; ➃ N2 and N2P will use TSMC's NanoFlex technology; ➄ N2 is 15% denser than N3E and improves performance by 10% to 15%; ➅ N2E will be followed by N2P and N2X in 2026; ➆ TSMC's planned capacity for 2nm is more than for 3nm; ➇ 2nm wafers are expected to cost $30k+.