➀ The Intel Xeon 6900P series, with 128 cores and 12 memory channels, marks Intel's return to server CPU leadership after trailing AMD for seven years; ➁ The series features new process technology and accelerators, aiming to compete with AMD's top-end parts; ➂ Intel's design strategy includes integrating memory controllers into compute tiles for better performance.

➀ Intel's decision to outsource chip manufacturing and the delay in its 7nm CPU technology are discussed; ➁ The reasons behind Intel's stagnation in 14nm process technology are analyzed, including the obsession with transistor density and the pursuit of GAA FET manufacturing processes; ➂ The challenges faced by Intel's design department, including excessive ambition and rigid thinking, are highlighted; ➃ The impact of TSMC's involvement and the internal issues within Intel are explored; ➄ The history of Intel's chip manufacturing process is reviewed, highlighting key milestones and setbacks; ➅ The role of the Technology Manufacturing Group (TMG) in Intel's history and its recent restructuring is discussed; ➆ Intel's struggle with the Tick-Tock model and its impact on product development is analyzed; ➇ The internal conflicts and management issues within Intel are examined; ➈ The future prospects for Intel and its potential strategies for recovery are considered.

➀ Intel has made a strong move after poor Q3 results, repositioning its foundry unit as an independent operation. This is aimed at attracting US rivals like AMD, Nvidia, and Qualcomm. The US Department of Commerce is encouraging this shift, with half of the world's top ten fabless companies based in the US. ➁ Intel's foundry unit is seen as a viable option for US hyperscalers looking for proprietary SOCs. ➂ With Intel's promise of the world's best foundry process next year, there's potential for significant growth.

➀ Intel is expected to announce a $3.5 billion military foundry contract; ➁ The contract is part of the Secure Enclave program administered by the US Department of Commerce; ➂ The contract shows the US government's confidence in Intel's ability to regain cutting-edge chipmaking capability.

➀ SK Keyfoundry, a division of SK Hynix, announces the launch of its fourth-generation 180nm BCDMOS process; ➁ The new process aims to strengthen the company's technological capabilities in power-demanding applications; ➂ The expansion in specialty foundry business is a strategic move for the company.

➀ Intel's ability to catch up with TSMC in process technology is questioned; ➁ Malcolm Penn, CEO of Future Horizons, suggests it could take 10 years to catch up; ➂ Intel's process capability is about a year behind TSMC; ➃ TSMC has been running its 3nm process for a year, while Intel's best process in volume production is Intel 4 at Leixlip.