Recent #Packaging news in the semiconductor industry

5 months ago

➀ The 75th annual IEEE Electronic Components and Technology Conference (ECTC) will take place from May 27-30, 2025, featuring a range of technical sessions, special sessions, and workshops on cutting-edge topics in electronic packaging and microelectronics.

➁ Keynote speaker Samuel Naffziger will discuss achieving efficient zettascale compute in the AI era.

➂ The conference will also feature a Heterogeneous Integration Roadmap (HIR) workshop and 16 Professional Development Courses.

ChipletEDAHPCPackagingPhotonic IntegrationThermal Managementsemiconductor
6 months ago

➀ GlobalFoundries plans to establish a new advanced packaging and testing center at its New York fabrication site, investing $575 million.

➁ The center will offer advanced packaging services for GF's differentiated silicon photonics platform, as well as full turnkey services for aerospace and defense customers.

➂ The U.S. Department of Commerce will contribute up to $75 million in direct funding, and New York state will provide additional support.

GlobalfoundriesPackagingsemiconductor
10 months ago
➀ The Intel Xeon 6900P series, with 128 cores and 12 memory channels, marks Intel's return to server CPU leadership after trailing AMD for seven years; ➁ The series features new process technology and accelerators, aiming to compete with AMD's top-end parts; ➂ Intel's design strategy includes integrating memory controllers into compute tiles for better performance.
AMDChipletEMIBEPYCHigh-Performance ComputingIntelPackagingProcess technologyXeoncpuperformanceserver