<p>➀ TSMC has chosen a 310x310mm substrate for its initial panel-level packaging (PLP) production, instead of the 510x515mm substrate initially tested.</p><p>➁ A source told Nikkei that the decision was made to start with a slightly smaller square shape rather than a larger one used in earlier trials, due to the difficulty of evenly coating the entire substrate with chemicals.</p><p>➂ The first production will take place on a pilot line in Taoyuan City in 2017.</p>