➀ Global spending on 300mm fab equipment is expected to reach $400 billion from 2025 to 2027; ➁ The Biden-Harris Administration launched the National Semiconductor Technology Center’s Workforce Center of Excellence with $250 million investment; ➂ TSMC extended partnerships with EDA companies for AI-driven tools and advanced packaging technologies; ➃ Qualcomm is considering making an offer for Intel; ➄ The U.S. government awarded $123 million to Polar Semiconductor for sensor and power semiconductors; ➅ JEDEC published two new CXL standards and MIPI Alliance announced MIPI A-PHY v2.0; ➆ SK hynix started mass producing the first 12-layer, 36GB HBM3E; ➇ Google DeepMind released details on its AI method for designing chip layouts, AlphaChip.