<p>➀ Yole Group forecasts the Panel Level Packaging (PLP) market to grow from $160 million to $600 million by 2030 with a CAGR of 27%;</p><p>➁ High-density fan-out and ultra-density platforms will dominate the market by 2030, driven by AI;</p><p>➂ Samsung Electronics leads the market in 2024, followed by ST, with PTI, SIPLP, and ASE holding less than 10% market share.</p>