➀ TSMC ends contract with Singapore-based PowerAIR over suspected Huawei ties; ➁ Concerns over potential violations of U.S. export controls; ➂ PowerAIR's lack of transparency raises suspicions about its end-user and technology transfer.

➀ The unreleased Core Ultra 200S CPU (codenamed Arrow Lake) has been delidded, revealing significant architectural changes by Intel; ➁ Arrow Lake features chiplets, with a compute tile, GPU tile, SOC tile, I/O tile, and a dummy tile; ➂ The new LGA 1851 socket is 9% larger than LGA 1700 and offers better CPU temperatures.

➀ The adoption of chiplets in domain-specific applications is creating complex partitioning challenges; ➁ Major companies are focusing on chiplets to improve performance and reduce power; ➂ Partitioning involves mapping optimal data paths, load balancing, and signal path workarounds; ➃ The shift towards chiplets is driven by scaling benefits limitations; ➄ Chiplets are assembled into advanced packages, affecting partitioning complexity; ➅ Partitioning determines application mapping, processing, and data movement priorities; ➆ Signal integrity challenges and power integrity issues arise with chiplet design; ➇ Chiplet partitioning must consider signal integrity, power integrity, and thermal gradients; ➈ Multi-vendor ecosystems and standard chiplet sockets are crucial for successful partitioning.

➀ The semiconductor industry is moving towards defining specific application sockets for chiplets to ensure interoperability and market viability. ➁ Standardization efforts like UCIe and BoW have focused on interconnects, but the real challenge lies in the link layer and application-specific requirements. ➂ The concept of 'sockets' refers to concretely defined mechanical, electrical, and functional specifications for chiplets, which will guide the development of interoperable chiplets.