<p>➀ GlobalFoundries plans to establish a new advanced packaging and testing center at its New York fabrication site, investing $575 million.</p><p>➁ The center will offer advanced packaging services for GF's differentiated silicon photonics platform, as well as full turnkey services for aerospace and defense customers.</p><p>➂ The U.S. Department of Commerce will contribute up to $75 million in direct funding, and New York state will provide additional support.</p>
Related Articles
- Sarcina Technology launches AI platform To enable cost-effective customizable packaging solutions for AI applications2 months ago
- Repealing the CHIPS Act could dramatically shrink US chip market share, analysts say3 months ago
- Indie Semi to use GloFo 22nm FD-SOI process for radar SoCs3 months ago
- ECTC 20253 months ago
- GlobalFoundries Announces Leadership Transition4 months ago
- The Global Expansion of Advanced Semiconductor Packaging Facilities: A 2025 Outlook4 months ago
- TSMC 2025 capex expected at $38-42bn5 months ago
- US bans sales of 14nm and 16nm chips with over 30 billion transistors to China5 months ago
- How to Ship a Wafer5 months ago
- IBM and GloFo settle dispute5 months ago