Recent #Thermal Management news in the semiconductor industry

2 months ago

➀ Researchers have explored a novel approach to boost thermal transport across solid interfaces by activating hyperbolic phonon-polariton (HPhP) modes in hexagonal boron nitride (hBN).

➁ These hybrid light–vibration modes can transfer energy at rates far exceeding conventional phonon–phonon conduction.

➂ The study shows that hBN can act as a high-performance medium for ultrafast thermal dissipation, with potential applications in high-frequency or high-power devices.

OptoelectronicsThermal Management
3 months ago

➀ Researchers from RWTH Aachen University analyzed the battery designs of Tesla and BYD, two major players in the EV market, by disassembling their batteries.

➁ The study found that Tesla's batteries prioritize high energy density and performance, whereas BYD's focus on space efficiency and lower-cost materials.

➂ Despite differences, both batteries share some similarities such as using laser welding for connecting thin electrode foils.

BYDEVTeslaThermal Managementbattery
3 months ago

➀ The 75th annual IEEE Electronic Components and Technology Conference (ECTC) will take place from May 27-30, 2025, featuring a range of technical sessions, special sessions, and workshops on cutting-edge topics in electronic packaging and microelectronics.

➁ Keynote speaker Samuel Naffziger will discuss achieving efficient zettascale compute in the AI era.

➂ The conference will also feature a Heterogeneous Integration Roadmap (HIR) workshop and 16 Professional Development Courses.

ChipletEDAHPCPackagingPhotonic IntegrationThermal Managementsemiconductor
4 months ago

➀ Same Sky's Thermal Management Group has introduced new thermoelectric generator (TEG) modules designed to recover waste heat and convert it into usable power.

➁ These TEG modules offer output power ranging from 5.4 to 21.6 W and can withstand temperatures up to 300°C.

➂ The modules are compact, have a low profile, and are available immediately with a starting price of $49.55 per unit.

Thermal Managementindustrial applications
6 months ago
➀ The Heat-Spring series of patterned metal TIMs by Indium Corporation is widely adopted for high-performance heat transfer in CPUs, GPUs, and power modules. ➁ Gallitherm's liquid metal TIMs offer high thermal conductivity and low interfacial resistance. ➂ The Durafuse HR solder paste is used in automotive applications for its high reliability and durability.
Electronics ManufacturingThermal Managementautomotive electronicssemiconductor industry
7 months ago
➀ Researchers from the University of Texas have developed a new colloidal thermal interface material that significantly improves thermal qualities by adding ceramic powder to liquid metal. ➁ The new TIM could reduce the cost and complexity of cooling power-hungry systems, with the potential to cut the energy needed for cooling pumps by 65%. ➂ The technology could enable sustainable cooling in energy-intensive applications, such as data centers and aerospace.
CoolingData CentersThermal ManagementThermal Pasteenergy efficiency
7 months ago
➀ The article discusses the energy consumption of train heating, cooling, and battery management systems. ➁ It highlights the efficiency of the DB-Baureihe 490, which uses a heat pump and waste heat recovery. ➂ The study suggests that integrated thermal management can improve the efficiency and range of battery-electric and hydrogen fuel cell trains.
Cooling SystemsRailway TechnologyThermal ManagementTransportationenergy efficiency
8 months ago
➀ The increasing demand for efficient heat dissipation in high-performance devices has led to the emergence of thermal interface materials (TIMs) as essential components in the electronics industry; ➁ TIMs are crucial for enhancing battery performance in electric vehicles, reliability in power electronics, and operational stability in data centres; ➂ The market for TIMs is growing significantly due to advancements in electronics and expanding applications in various sectors.
Thermal Managementdata centreselectronicspower electronics
9 months ago
➀ Fraunhofer Heinrich-Hertz-Institut (HHI) has developed a new method for producing thermally emissive surface structures using reactive gas-assisted nanosecond laser processing on aluminum alloys for spacecraft electronic boxes. ➁ The NanoBLAST project, funded by the Federal Ministry for Economic Affairs and Climate Action, aims to scale up and commercialize this technology. ➂ The project focuses on optimizing laser parameters and adapting the laser setup for real components with curvatures and recesses, marking a significant advancement in space-appropriate thermal regulation.
Fraunhofer HHISpaceThermal Management