➀ The Heat-Spring series of patterned metal TIMs by Indium Corporation is widely adopted for high-performance heat transfer in CPUs, GPUs, and power modules. ➁ Gallitherm's liquid metal TIMs offer high thermal conductivity and low interfacial resistance. ➂ The Durafuse HR solder paste is used in automotive applications for its high reliability and durability.
Related Articles
- What Is Substrate? A Thiel-Backed Chip Startup Seeking to Crack ASML’s Dominance6 days ago
 - New Machine To Mount Chips Precisely Onto PCBs8 days ago
 - Navigating American Restrictions: China's Chip Industry Innovates Amid Challenges9 days ago
 - TSMC's Hou Confident Rare Earth Reserves Stable in Short Term, Moves to Reduce Reliance on China10 days ago
 - Cost Out Engineer-Electronics Category At Eaton In Puneabout 2 months ago
 - NANO Nuclear Energy: Concepts Of A Plan With Many Patents2 months ago
 - Reference Design For Intelligent Cooling Plate5 months ago
 - Noctua’s new offset mounting bars improves NH-D15 G2 cooling on Intel Core Ultra CPUs6 months ago
 - Former ASML Head Scientist Lin Nan Leads China's EUV Breakthrough6 months ago
 - Control of Wafer Scanners: Methods and Developments6 months ago