Recent #fab news in the semiconductor industry

5 months ago

➀ TSMC plans to start construction of its third factory in Arizona by mid-2025, a year ahead of schedule.

➁ The new CoWoS advanced packaging plant in the US is also under consideration.

➂ This expansion is part of TSMC's strategy to increase its presence in the US amidst concerns over foreign control of the semiconductor industry.

ArizonaSEMICONDUCTORTSMCUS presenceadvanced packagingfab
4 months ago

➀ Intel has achieved an exciting milestone with the first run of 18A (1.8nm-class) wafers at its Arizona fab;

➁ The milestone involves transferring the new fabrication process to a brand-new facility in Arizona;

➂ Intel plans to mass produce compute chiplets for Panther Lake processors and Xeon 7 processors for datacenters using the 18A technology.

ArizonaChipletIntelManufacturing ProcessPower ConsumptionTransistorfabsemiconductor
5 months ago

➀ SkyWater Technology has entered into an agreement with Infineon Technologies AG to purchase Infineon's 200 mm fab in Austin, Texas, known as Fab 25.

➁ The acquisition includes a corresponding long-term supply agreement.

➂ SkyWater plans to operate the fab as a foundry to expand U.S. foundry capacity for foundational chips.

InfineonSkyWaterfabfoundrysemiconductortechnology
10 months ago
➀ Intel is expected to announce a $3.5 billion military foundry contract; ➁ The contract is part of the Secure Enclave program administered by the US Department of Commerce; ➂ The contract shows the US government's confidence in Intel's ability to regain cutting-edge chipmaking capability.
AMDArizonaChipmakingIntelMilitaryNVIDIAProcess technologySecure EnclaveUS Chips ActUS Department of Commercefabfoundrysemiconductor
11 months ago
➀ ESMC, a joint venture between TSMC, Bosch, Infineon, and NXP, has started construction on its first fab in Dresden, with the EU approving a €5 billion subsidy from the German government for the €10 billion project. ➁ The facility, when operational, will produce 40,000 300mm wafers monthly using TSMC's 28/22nm planar CMOS and 16/12nm FinFET technologies, creating around 2,000 direct jobs and stimulating numerous indirect jobs. ➂ The project aims to be environmentally friendly, including energy-efficient construction and water reclamation, with plans to obtain LEED certification.
BoschDresdenEUGermanyInfineonNXPTSMCfabsemiconductor