➀ ESMC, a joint venture between TSMC, Bosch, Infineon, and NXP, has started construction on its first fab in Dresden, with the EU approving a €5 billion subsidy from the German government for the €10 billion project. ➁ The facility, when operational, will produce 40,000 300mm wafers monthly using TSMC's 28/22nm planar CMOS and 16/12nm FinFET technologies, creating around 2,000 direct jobs and stimulating numerous indirect jobs. ➂ The project aims to be environmentally friendly, including energy-efficient construction and water reclamation, with plans to obtain LEED certification.