➀ This article introduces a two-phase power meter reference design featuring a high-performance analog front end and an embedded programmable gain amplifier, enhancing precision and cost-efficiency in energy measurement; ➁ The design is based on the Kinetis M series microcontrollers from NXP Semiconductors, designed for smart single-phase and two-phase energy meters; ➂ The design includes features like tamper detection, low-power modes, and AMI expansion headers for advanced metering infrastructure and remote control functionalities.

➀ This article discusses the RGB LED lighting reference design developed by NXP Semiconductors. It highlights the board's features, such as microcontroller and high-voltage analog components, and its applications in automotive and industrial sectors. ➁ The S12ZVL32-LED board, featuring a 16-bit S12 MagniV S12ZVL microcontroller and LIN interface, is ideal for space-constrained automotive LIN nodes. ➂ The article also mentions the S12ZVL family's memory options and its integration of features from the S12 portfolio.

➀ Cadence's Tensilica HiFi 5 DSPs are integrated into NXP's new automotive audio DSP family; ➁ The integration supports advanced audio capabilities for next-generation software-defined vehicles; ➂ This development caters to the increasing demand for sophisticated audio processing.

➀ The article introduces the Pluto radar sensor reference design by NXP, a 28nm single-chip radar SoC; ➁ It highlights the high RF performance and flexibility of the design for various radar applications; ➂ The design is targeted for vehicle safety features like automatic cruise control and obstacle detection.

➀ NXP introduces an ASIL D safety-certified vehicle battery junction box controller IC; ➁ The MC33777A measures currents, voltages, and temperatures to detect faults; ➂ It includes dual signal chains, redundancy, and multiple ADCs for accuracy.

➀ Great Linker Group introduces an OP-Gyro SBC solution based on NXP products. ➁ The solution is designed for specific applications in the electronics industry. ➂ It leverages NXP's advanced technology to enhance performance and efficiency.

➀ ESMC, a joint venture between TSMC, Bosch, Infineon, and NXP, has started construction on its first fab in Dresden, with the EU approving a €5 billion subsidy from the German government for the €10 billion project. ➁ The facility, when operational, will produce 40,000 300mm wafers monthly using TSMC's 28/22nm planar CMOS and 16/12nm FinFET technologies, creating around 2,000 direct jobs and stimulating numerous indirect jobs. ➂ The project aims to be environmentally friendly, including energy-efficient construction and water reclamation, with plans to obtain LEED certification.

1. Gettobyte Technologies Pvt. Ltd. has launched the Autoboard V1, an evaluation board built around the NXP S32K344EHT1VPBST chipset, featuring CAN, Ethernet, LIN, and versatile I/O for prototyping. 2. The board supports a wide input voltage range of 6V to 17V and includes an onboard debugger and USB to UART converter. 3. Suitable for various engineers and hobbyists, the board integrates multiple peripherals and offers flexible power options.

1. Congatec introduces new computer-on-modules with NXP's i.MX 95 processors, offering triple computing power and double AI inference capabilities. 2. The modules feature enhanced security with hardware-integrated EdgeLock and real-time processing. 3. Designed for a wide temperature range, these modules are suitable for various applications including industrial production, machine vision, and medical imaging.

1. NXP has upgraded its isolated gate drivers for electric vehicles. 2. The new drivers are designed to handle higher voltage levels. 3. NXP is supplying these upgraded drivers to ZF Friedrichshafen.