<p>➀ Silicon photonics heterogeneous integration: OpenLight Photonics demonstrates its tunable and DFB lasers based on silicon photonics heterogeneous integration on the Tower Semiconductor platform. Heterogeneous IIIV on silicon has started commercial use.</p><p>➁ Silicon photonics flip-chip bonding integration: Narrow linewidth external cavity tunable lasers are achieved using mature flip-chip bonding technology, with a key bonding precision of 700nm@3σ, reaching mass production level.</p><p>➂ Silicon photonics end-to-end hybrid integration: End-to-end coupling uses SSC to make ultra-low kappa grating performance external cavity. It has fast frequency sweep characteristics using LNOI, and is important for sensing applications.</p>