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thelec.net 主要提供关于SK Hynix、Samsung等韩国半导体行业的最新新闻，包括HBM、DRAM和NAND等信息。
December 10
- 3ALogics to launch a dozen of new NFC chips next year➀ 3ALogics, an NFC fabless chip company, plans to launch around ten new NFC-based wireless charging chips next year; ➁ The company's CEO, Park Kwang-beom, stated during a conference that they have selected to focus on approximately 10 categories of NFC chips to achieve success; ➂ The new chips are part of the company's strategy to expand its NFC chip offerings.
- 3ALogics to launch a dozen of new NFC chips next year➀ 3ALogics is planning to launch around ten new NFC-based wireless charging chips next year; ➁ The company has selected to focus on approximately 10 categories of NFC chips from over a hundred; ➂ CEO Park Kwang-beom emphasized the strategic choice for success.
December 6
- FOUP cleaner ISTE to also expand into PECVD➀ FOUP cleaner ISTE is expanding into plasma-enhanced chemical vapor deposition (PECVD) equipment; ➁ Cho Chang-hyun, the CEO of the fab equipment manufacturer, announced this at the company's IPO conference; ➂ The PECVD equipment market is 30 times larger than that of FOUP.
- SK Hynix beefs up executive team amid high number of promotions➀ SK Hynix has strengthened its executive team with a significant number of promotions at the end of the year; ➁ Executive Vice President Ahn Hyun has been promoted to President and also takes on the new role of Chief Development Officer (CDO); ➂ Ahn Hyun previously led SK Hynix’s N-S Committee, which was formed to enhance certain aspects of the company.
- SK Hynix beefs up executive team amid high number of promotions➀ SK Hynix has strengthened its executive team with a significant number of promotions at the end of the year. ➁ Executive Vice President Ahn Hyun has been promoted to President and also appointed as Chief Development Officer (CDO). ➂ Ahn previously led SK Hynix’s N-S Committee.
- FOUP cleaner ISTE to also expand into PECVD➀ FOUP cleaner manufacturer ISTE is expanding into plasma-enhanced chemical vapor deposition (PECVD) equipment; ➁ The CEO of the fab equipment maker, Cho Chang-hyun, mentioned this during the company’s conference; ➂ The PECVD equipment market is 30 times larger than the FOUP market.
December 5
- LB Semicon, DB Hitek to co-develop power chip➀ LB Semicon and DB Hitek announced a collaboration to co-develop an enhanced redistribution layer (RDL) for high power chips; ➁ The RDL is a metal layer that connects the I/O pad inside the chip to the outside; ➂ The layer is used in high-performance applications.
- LB Semicon, DB Hitek to co-develop power chip➀ LB Semicon and DB Hitek have announced a collaboration to co-develop an enhanced redistribution layer (RDL) for high-power chips; ➁ The RDL is a metal layer that connects the I/O pad within the chip to the outside world; ➂ This collaboration aims to improve the performance and connectivity of high-power chips.
- Samsung to change packaging method of low-power DRAM used in iPhones➀ Samsung is conducting research to modify the packaging method for the LPDDR used in iPhones; ➁ The change is in response to Apple's request to convert the LPDDR IC into a discrete package; ➂ The new packaging will involve packaging the LPDDR separately.
December 4
- Isu Petasys gives up plan to buy JEIO➀ Isu Petasys has decided to withdraw from its plan to acquire carbon nanotube manufacturer JEIO; ➁ The decision was personally ordered by Kim Sang Beom, the chairman of Isu Group; ➂ With the cancellation, Isu Petasys will be giving up the 15.8 billion won deposit that has already been paid.
- Isu Petasys gives up plan to buy JEIO➀ Isu Petasys has abandoned its plan to acquire carbon nanotube manufacturer JEIO; ➁ The decision was personally ordered by Kim Sang Beom, the chairman of Isu Group; ➂ Isu Petasys will forgo the 15.8 billion won deposit that was already paid.
- Samyang NC Chem’s serial violation draws concern before IPO➀ Samyang NC Chem, a photoresist firm, has been fined 16 times in the past six years; ➁ The fines have raised concerns as the company is preparing for its IPO; ➂ The company operates two factories in Gongju City, South Choongcheong Province.
November 28
- Samsung year-end reshuffle focuses on chip division amid 'crisis'➀ Samsung's annual reshuffle is centered on its chip division; ➁ The company is facing a crisis as concerns over the division's future grow; ➂ Samsung announced new presidents for the Device Solutions division.
- Samsung year-end reshuffle focuses on chip division amid 'crisis'➀ Samsung's year-end reshuffle is centered on its chip division; ➁ The company is facing what it describes as a crisis with growing concerns about the division's future; ➂ Samsung announced new presidents for the Device Solutions (DS) division.
November 26
- DeepX to receive DX-M1 wafer at end of year➀ DeepX is set to receive the production wafer for its DX-M1 chip from Samsung Foundry by the end of the year; ➁ The chip's multi-project wafers are being produced in collaboration with design house Gaonchips and Samsung Foundry; ➂ DeepX has entered into a 7.2 billion won production deal with Gaonchi.
- Samsung succeeds in reducing use of PR during 3D NAND lithography➀ Samsung has significantly reduced the amount of photoresist (PR) used in the photolithography process for its 3D NAND flash production. ➁ The company plans to use only half the amount of PR in future NAND production. ➂ The move is part of Samsung's effort to enhance its manufacturing efficiency and reduce costs.
November 25
- TCK wins SiC patent lawsuits against YMC, Wycom➀ TCK announced on Friday that it has won a patent infringement lawsuit against YMC and Wycom over silicon carbide (SiC) rings; ➁ The lawsuit was filed four years ago, and TCK was also seeking damages; ➂ The patents relate to SiC structures capable of withstanding plasma and possess certain physical characteristics.
- South Korea's Mdevice approved to go public➀ South Korean chip storage company Mdevice has received preliminary approval to list on Kosdaq; ➁ The company filed for the listing in September; ➂ The listing is based on a special rule allowing unprofitable companies to go public.
November 22
- SK Hynix begins 321-layer NAND production➀ SK Hynix has commenced production of its 321-layer NAND chip; ➁ The chip features the highest number of layers in the industry; ➂ The product was first introduced at Flash Summit 2023 in August.
November 21
- Point2 Technology expects over 1 trillion won in valuation when it lists on Kosdaq➀ Point2 Technology, a fabless chip company, is aiming for a valuation of over 1 trillion won upon its listing on the Korean bourse Kosdaq in 2026; ➁ The company CEO, Sean Park, has stated that they expect revenues of over 10 billion won in 2025, increasing to 50 billion won and 100 billion won in 2026 and 2027 respectively.
- YEST to supply eFurnace used in HBM production to SK Hynix➀ YEST announced that it will supply 11.16 billion won worth of eFurnace to SK Hynix; ➁ The eFurnace is used for purifying wafers and enhancing their electrical properties; ➂ SK Hynix is expected to use the equipment in HBM production.
November 19
- Telechips to focus on mid-end auto chips➀ Telechips is focusing on mid-end SoCs for the global car market; ➁ The strategy is to compete with larger rivals like Qualcomm and MediaTek; ➂ Lee, the CEO, highlighted the importance of staying competitive.
November 15
- Neosem posts record Q3 profit backed by Gen 5 SSD tester➀ Neosem reported its highest third quarter profit ever; ➁ The strong sales of its Gen 5 SSD testers contributed to the profit; ➂ The demand for its DDR5 server DIMM module tester, used in AI infrastructure, was also high.
November 14
- SemiFive expects revenue to exceed $70 million as it eyes IPO➀ SemiFive is expected to exceed $70 million in revenue after only five years of operation; ➁ The company is a Design Solution Partner (DSP) to Samsung Foundry; ➂ SemiFive offers its own SoC design platform to its fabless customers.
November 7
- Chips&Media receives TSMC’s 3nm library➀ Chips&Media, a South Korean video IP firm, announced the acquisition of TSMC's 3nm library; ➁ This will allow Chips&Media's customers to assess compatible IPs before contract signing; ➂ The move signifies a strategic partnership between the two companies.
November 5
- SK Hynix to provide HBM3E 16H samples in early 2025➀ SK Hynix is scheduled to provide samples of its Gen 5 HBM, HBM3E 16H, in early 2025; ➁ The HBM3E 16H features 16 stacked DRAM dies and will utilize mass reflow molding technology; ➂ SK Hynix CEO Kwak Noh-jung announced this at an event hosted by SK Group.
October 24
- SK Hynix CEO says HBM 3E 12H production on trackSK Hynix CEO Kwak Noh-jung confirmed production plans for HBM3E 12H, indirectly denying rumors of delays, while rejecting concerns over Nvidia's AI accelerator issues.
October 22
- Hundreds of Samsung engineers apply for SK Hynix etching jobHundreds of Samsung engineers apply for SK Hynix job amidst Samsung's chip business crisis; Engineer exodus to other companies and government, concerns about Samsung's competitiveness.
October 18
- ADTechnology to collaborate with Samsung, Arm for AI chiplet developmentADTechnology collaborates with Samsung and Arm for AI chiplet development, enabling better performance and reduced costs through modular chip design.
October 16
- Wonik D2I anticipating OLED DDI supply deal with Samsung DisplayWonik D2I anticipating OLED DDI supply deal with Samsung Display, expected to go through final quality test in November.