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thelec.net 主要提供关于SK Hynix、Samsung等韩国半导体行业的最新新闻，包括HBM、DRAM和NAND等信息。
October 3
- SK Hynix places order for TC bonders to ASMPT➀ SK Hynix has placed a significant order for thermal compression bonders from ASMPT; ➁ The equipment is for the production of HBM3E 12H, SK Hynix's newest high-bandwidth memory; ➂ The order includes over 30 units of the equipment.
October 2
- DRAM and NAND prices drop by over 10% in September➀ Contract prices of DRAM and NAND dropped by over 10% in September; ➁ The decline was due to low demand for PCs and consumer electronics; ➂ DDR4 8Gb 1Gx8 prices fell by 17.07% to US$1.7.
September 25
- DB Hitek close to clinching 10-year Tesla power chip deal➀ DB Hitek is on the verge of signing a ten-year deal to manufacture power management ICs for Tesla vehicles. ➁ The quality control staff of the US carmaker visited DB Hitek's facility in South Korea for an inspection in June. ➂ The deal involves manufacturing power management ICs for Tesla vehicles.
September 24
- CXL Linux developers: a new battleground for memory makers➀ Memory manufacturers are competing to win over server operating system developers; ➁ Samsung is collaborating with Red Hat; ➂ SK Hynix appears to be aiming to win over the entire ecosystem.
- LPKF denies Philoptics’ allegation that its TGV tech offers limited hole sizes➀ LPKF refutes Philoptics' claims about its TGV technology; ➁ Philoptics alleged LPKF's technology offers limited hole sizes; ➂ LPKF disputes Philoptics' claim of technological superiority.
August 30
- SK Hynix develops 1c DDR5 DRAM ahead of Samsung➀ SK Hynix has announced the development of a Gen 6 10-nanometer (nm) 16Gb DDR5 DRAM, marking the first in the industry. ➁ This development positions SK Hynix ahead of its domestic competitor, Samsung, which began manufacturing Gen 5 DRAM in May. ➂ The competition between SK Hynix and Samsung continues to drive advancements in DRAM technology.
August 13
- SK Hynix to develop 4F2 DRAM to reduce cost➀ SK Hynix announces plans to develop a 4F2 DRAM similar to Samsung; ➁ The cost of EUV processes has been rapidly increasing since the commercialization of 1c DRAM; ➂ Seo Jae Wook, an SK Hynix researcher, highlighted this during an industry conference in Seoul.
July 30
- SK Hynix to build new fab to respond to high demand from AI1. SK Hynix plans to invest 9.4 trillion won to construct a new fab in response to the high demand for memory chips driven by AI. 2. The new fab will be located at the Yongin Semiconductor Cluster, a new industrial zone supported by the South Korean government. 3. Construction of the fab is set to commence soon.
July 26
- SK Hynix records profit in 6 years backed by HBM1. SK Hynix achieved its highest operating profit in six years during the second quarter of 2023. 2. The company reported revenue of 16.42 trillion won and operating profit of 5.46 trillion won. 3. Net income for the quarter was 4.12 trillion won.
July 25
- SK Hynix replaced NF3 with environmentally friendly F2 gas1. SK Hynix has implemented a more environmentally friendly gas in its chip production cleaning processes. 2. The company replaced nitrogen trifluoride (NF3) with a gas that has low global warming potential. 3. This change was detailed in SK Hynix's 2024 sustainability report.
July 24
- Samsung Electro-Mechanics to supply AMD with data center FC-BGA1. Samsung Electro-Mechanics announced it will supply high-performance chip boards for hyperscale data centers to AMD. 2. The chip boards are flip chip-ball grid array (FC-BGA). 3. This is the first official confirmation of the deal by Samsung Electro-Mechanics.
- Namhae Chemical’s subsidiary supplies sulfuric acid prototype to Samsung1. Namhae Chemical's subsidiary, NES Materials, has provided a prototype of high-purity sulfuric acid to Samsung for chip production. 2. The sulfuric acid, used for cleaning wafers, is undergoing performance testing by Samsung. 3. NES Materials is a joint venture established in 2021.
July 17
- Genesem supplies new kits for use in hybrid bonding process in HBM to SK Hynix1. Genesem, a semiconductor packaging firm, has provided next-generation hybrid bonding equipment to SK Hynix. 2. The equipment is intended for use in the production of high-bandwidth memory (HBM). 3. Two units of the equipment have been installed at SK Hynix’s pilot fab for testing purposes.
July 16
- Doosan Tesna aims to become integrated OSAT firm1. Doosan Tesna plans to integrate chip packaging capabilities with its existing chip testing business. 2. The goal is to develop the company into an integrated outsourced semiconductor assembly and test firm. 3. This move likely aims to offer comprehensive services including wafer test and packaging.
July 12
- Alphawave Semi to form South Korean office1. Alphawave Semi plans to establish an office in South Korea to enhance IP sales to local fabless chip companies. 2. The company currently has a small number of staff in the country, with headquarters directly supporting fabless and design house customers. 3. Alphawave Semi, a chipless semiconductor company, aims to expand its presence in the South Korean market.
July 11
- Fadu to own and sell CXL switch chip made by subsidiary Eeum1. Fadu will own and sell the CXL switch chip developed by its subsidiary Eeum; 2. Eeum CEO Jinki Han will define the hardware model and architecture of the chip; 3. Fadu will take over the register transfer level coding and oversee production and sale.
July 9
- Jusung developing ALD tech to reduce EUV process steps1. Jusung Engineering is developing ALD technology to reduce the number of steps in the EUV process. 2. The chairman of Jusung Engineering, Chul Joo Hwang, believes that stacking transistors will be the future of semiconductor development. 3. This approach is seen as necessary due to the limitations in scaling DRAM and logic chips, similar to how NAND stacks transistors.
- KCTech’s supercritical cleaner being evaluated for SK Hynix’s DRAM line1. KCTech's supercritical fluid cleaner is being evaluated by SK Hynix for use in its DRAM production line. 2. SK Hynix currently procures this equipment from Tokyo Electron. 3. If KCTech passes the evaluation, it will become a secondary supplier.
July 6
- Nepes to sell loss-ridden Nepes Laweh after restructuring1. Nepes has decided to sell its loss-making chip package division, Nepes Laweh. 2. The company has informed private equity funds, which provided loans to Nepes Laweh, about its restructuring and sale plans. 3. Nepes intends to retain the bare minimum of researchers at Nepes Laweh before proceeding with the sale.
July 5
- Neosem supplies CXL 2.0 memory inspection kit to Samsung1. Neosem has become the first company to supply inspection equipment for CXL 2.0 memory production. 2. The equipment is used to determine the operability of CXL 2.0 memory modules. 3. The customer for this new equipment is Samsung.
July 4
- Samsung developing new chip package tech to prevent AP overheating1. Samsung is developing a new chip package technology to address overheating issues in application processors (AP). 2. The technology involves attaching a heat path block (HPB) on top of the SoC. 3. It is expected to be implemented in future Exynos chips.
July 3
- Samsung applies molybdenum in Gen 9 V-NAND1. Samsung is using molybdenum in the metalization process of its 9th generation V-NAND. 2. The company has acquired five molybdenum deposition machines from Lam Research. 3. Samsung plans to introduce twenty more units next year.
July 2
- LX Semicon’s IPM passes LG Electronics’ prototype test1. LX Semicon, a fabless chip firm, is entering the intelligent power module (IPM) market. 2. The company has developed a 600V IPM suitable for home appliances like refrigerators, washing machines, and air conditioners. 3. LX Semicon is in talks with LG Electronics for potential supply.
June 28
- Micron sells out HBM capacity up to 20251. Micron announced that its High Bandwidth Memory (HBM) production capacity is fully booked until 2025. 2. This follows SK Hynix's earlier statement that its HBM capacity is sold out until next year. 3. Micron reported a revenue of $6.811 billion for the fiscal quarter from March to May, marking an increase.
June 27
- Hanmi Semiconductor loses packaging equipment patent battle against Genesem1. Hanmi Semiconductor lost a patent lawsuit against Genesem concerning packaging equipment patents. 2. The court not only ruled against Hanmi but also nullified its patents. 3. The lawsuit was filed in the Seoul Central District Court.
June 26
- South Korea’s blank mask export jumps in May1. South Korea's export of blank masks, essential for chip production, surged by 46% in May compared to the previous year. 2. The total export value reached $2.56 million, with China being the primary importer at $1.93 million, constituting 75.3% of the total exports. 3. This significant increase highlights the growing demand for semiconductor manufacturing materials in the global market.
- Semes develops ArF-i track equipment1. Samsung's subsidiary Semes has developed an ArF-i lithography track equipment named Omega Prime. 2. The first unit was supplied last year, and the company is currently manufacturing a second unit.
June 19
- Samsung and SK Hynix to apply hybrid bonding on 3D DRAM1. Samsung and SK Hynix, South Korean memory chipmakers, are planning to adopt hybrid bonding technology for their upcoming 3D DRAM products. 2. SK Hynix announced its intention to use wafer bonding, a form of hybrid bonding, in the production of 3D DRAM during the International Memory Workshop 2024 in Seoul.
June 13
- LG-backed AI NPU firm Aim Future to open Series B funding round1. Aim Future, an AI neural processing unit (NPU) company backed by LG, plans to initiate its Series B funding round in the second half of the year. 2. The startup aims to open the funding round between October and November. 3. The goal is to close the funding round in the first half of 2025.
June 12
- 'Glass substrates to replace 2.5D package in chips in the future'1. The use of glass substrates is expected to challenge the current advanced packaging technologies like TSMC's CoWoS. 2. Glass substrates are targeted for use in AI and server semiconductor applications. 3. A university professor predicts the commercialization of glass substrates will disrupt the market dominance of existing technologies.