➀ Glass substrates offer superior flatness and higher interconnect densities, potentially replacing organic substrates and silicon interposers. ➁ They provide better thermal matching with silicon dies and can handle higher chip densities. ➂ Challenges include brittleness, adhesion issues, and lack of industry standards.

1. The use of glass substrates is expected to challenge the current advanced packaging technologies like TSMC's CoWoS. 2. Glass substrates are targeted for use in AI and server semiconductor applications. 3. A university professor predicts the commercialization of glass substrates will disrupt the market dominance of existing technologies.