1. Neo Semiconductor has developed 3D DRAM with neuron circuitry to accelerate AI processing by avoiding data transfers from HBM to GPUs; 2. The 3D X-AI 300-layer, 128 Gbit DRAM chip offers 10 TBps of AI processing per die and can scale up to 120 TBps; 3. Neo claims the 3D X-AI chip is ideal for accelerating next-generation AI chips and applications by simulating artificial neural networks.

1. Samsung and SK Hynix, South Korean memory chipmakers, are planning to adopt hybrid bonding technology for their upcoming 3D DRAM products. 2. SK Hynix announced its intention to use wafer bonding, a form of hybrid bonding, in the production of 3D DRAM during the International Memory Workshop 2024 in Seoul.