1. Neo Semiconductor has developed 3D DRAM with neuron circuitry to accelerate AI processing by avoiding data transfers from HBM to GPUs; 2. The 3D X-AI 300-layer, 128 Gbit DRAM chip offers 10 TBps of AI processing per die and can scale up to 120 TBps; 3. Neo claims the 3D X-AI chip is ideal for accelerating next-generation AI chips and applications by simulating artificial neural networks.