1. Alphawave Semi has developed the industry's first multi-protocol I/O connectivity chiplet for HPC and AI, delivering 1.6Tbps throughput; 2. The chiplet supports various protocols including PCIe, CXL, and Ethernet, enhancing data transfer efficiency and AI model training; 3. Alphawave Semi's focus on both technical and business factors is driving the adoption and sustainability of chiplet technology in high-performance computing and AI applications.
Recent #Alphawave Semi news in the semiconductor industry
1. Alphawave Semi plans to establish an office in South Korea to enhance IP sales to local fabless chip companies. 2. The company currently has a small number of staff in the country, with headquarters directly supporting fabless and design house customers. 3. Alphawave Semi, a chipless semiconductor company, aims to expand its presence in the South Korean market.
1. The article discusses the importance of PCIe and CXL technologies in modern computing infrastructures, highlighting their role in supporting high data transfer rates essential for AI/ML training and big data analytics. 2. It covers the recent webinar sponsored by Alphawave Semi, focusing on the challenges and advancements in optical interfaces and the need for collaborative innovation. 3. The article also explores the benefits of Linear Pluggable Optics (LPO) and energy-efficient accelerator cards in enhancing data center performance and scalability.
Alphawave Semi is sampling its portfolio of optoelectronics products targeting the high-speed interconnect semiconductor market, expected to exceed $4 billion by 2028. The portfolio includes DSPs for PAM4 and emerging Coherent-lite modulation, using PAM4 SerDes with its WidEye DSP architecture and EyeQ diagnostic technology. The 800G and 1.6T interconnect products support up to 20km optical reach based on PAM4 and Coherent-lite solutions.
Siemens Partners with Alphawave to Accelerate Customer Time-to-Market with Advanced Semiconductor IP
➀ Siemens Digital Industries Software announces an exclusive OEM agreement with Alphaw Semi to market its high-speed interconnect silicon IP product portfolio through its sales channels.
➁ The agreement includes Alphawave Semi's leading IP platform for connectivity and memory protocols such as Ethernet, PCIe, CXL, HBM, and UCIeDie-to-Die).
➂ The collaboration will provide comprehensive Spec to Silicon Solutions by leveraging the combined capabilities and strengths of both companies.
➀ Alphawave Semi has appointed Sameer Ladiwala as its new chief accounting officer (CAO) and senior vice president of finance. ➁ Ladiwala brings over 25 years of financial management experience, with a focus on semiconductor and technology sectors. ➂ He will be responsible for overseeing complex financial transactions and will be based at the company's San Jose headquarters.
1. Alphawave Semi introduces the industry's first UCIe Die-to-Die IP at 3nm using TSMC's CoWoS advanced packaging technology; 2. The IP offers 8 Tbps/mm bandwidth density and supports 24 Gbps device-to-device data rates; 3. Aimed at hyperscale, high-performance computing, and AI applications, the IP features high interoperability and robust performance.
1. Alphawave Semi claims to have successfully brought up the first 3nm UCIe Die-to-Die (D2D) IP with TSMC's CoWoS advanced packaging technology. 2. The complete PHY and Controller subsystem was developed in collaboration with TSMC, targeting applications like hyperscaler, HPC, and AI. 3. The IP supports multiple protocols and integrates live per-lane health monitoring, setting a new benchmark in high-performance connectivity solutions.
1. Alphawave Semi has collaborated with Arm to develop a compute chiplet based on Arm Neoverse Compute Subsystems. 2. The chiplet targets AI/ML, HPC, data centres, and 5G/6G networking applications, enhancing performance and scalability. 3. This partnership accelerates custom SoC development and reduces time to market for new technologies.