➀ UCIe drives modern chip design with high-bandwidth data transfer, thermal efficiency, and reduced leakage;

➁ Integrates bioinspired advancements, system co-optimization, and 3D packaging to transform AI, HPC, and consumer electronics;

➂ Advances optical I/O to push technological boundaries in semiconductor innovation.

➀ Ayar Labs has unveiled the world's first UCIe optical chiplet, designed to eliminate data bottlenecks, reduce latency, and cut power consumption while enabling interoperability between chiplets from different vendors.

➁ The TeraPHY chiplet offers 8 Tbps bandwidth and is powered by Ayar Labs' 16-wavelength SuperNova light source, making it suitable for scalable AI architectures.

➂ AMD supports the UCIe standard, recognizing its importance in driving innovation and meeting the needs of AI scale-up solutions.

➀ Engineered substrate technology is driving the semiconductor industry from traditional planar scaling to innovative materials and 3D integration.

➁ Companies like Soitec, Intel, and Samsung are leading the adoption of this technology.

➂ Foundries are increasingly recognizing the strategic importance of engineered substrates like Fully Depleted SOI (FD-SOI) for their benefits in cost and performance.