➀ Multi-die architectures using UCIe protocol face verification challenges including inter-die communication and evolving protocol features;

➁ Siemens EDA's Questa One Avery™ VIP provides layered verification with AI-driven coverage and configurable testbenches;

➂ The solution supports compliance testing, real-time performance monitoring, and scalability from simulation to hardware prototyping.

➀ Rebellions unveiled its REBEL-Quad AI accelerator at Hot Chips 2025, featuring four ASICs with 144GB HBM3E memory and UCIe chiplet interconnects.

➁ The PCIe Gen5 accelerator demonstrated live inference of Llama 3.3 70B models at 35.5ms/token using Samsung SF4X and CoWoS-S packaging.

➂ This marks a significant commercial implementation of UCIe technology, showcasing inter-chip communication advancements in AI hardware design.

➀ The UCIe 3.0 specification doubles data transfer rates to 64GT/s for chiplet-based designs, significantly improving bandwidth density and enabling faster interconnects for 2D/2.5D packaging;

➁ Introduces new features like continuous transmission protocols, enhanced runtime recalibration, and L2 exit handshake to optimize power efficiency and link reliability;

➂ UCIe 3.0 lays the foundation for future chiplet ecosystems, with commercial products expected around 2026-2028 as adoption by major semiconductor companies accelerates.

➀ UCIe drives modern chip design with high-bandwidth data transfer, thermal efficiency, and reduced leakage;

➁ Integrates bioinspired advancements, system co-optimization, and 3D packaging to transform AI, HPC, and consumer electronics;

➂ Advances optical I/O to push technological boundaries in semiconductor innovation.

➀ Ayar Labs has unveiled the world's first UCIe optical chiplet, designed to eliminate data bottlenecks, reduce latency, and cut power consumption while enabling interoperability between chiplets from different vendors.

➁ The TeraPHY chiplet offers 8 Tbps bandwidth and is powered by Ayar Labs' 16-wavelength SuperNova light source, making it suitable for scalable AI architectures.

➂ AMD supports the UCIe standard, recognizing its importance in driving innovation and meeting the needs of AI scale-up solutions.

➀ Engineered substrate technology is driving the semiconductor industry from traditional planar scaling to innovative materials and 3D integration.

➁ Companies like Soitec, Intel, and Samsung are leading the adoption of this technology.

➂ Foundries are increasingly recognizing the strategic importance of engineered substrates like Fully Depleted SOI (FD-SOI) for their benefits in cost and performance.