1. Alphawave Semi claims to have successfully brought up the first 3nm UCIe Die-to-Die (D2D) IP with TSMC's CoWoS advanced packaging technology. 2. The complete PHY and Controller subsystem was developed in collaboration with TSMC, targeting applications like hyperscaler, HPC, and AI. 3. The IP supports multiple protocols and integrates live per-lane health monitoring, setting a new benchmark in high-performance connectivity solutions.