<p>➀ The UCIe 3.0 specification doubles data transfer rates to 64GT/s for chiplet-based designs, significantly improving bandwidth density and enabling faster interconnects for 2D/2.5D packaging;</p><p>➁ Introduces new features like continuous transmission protocols, enhanced runtime recalibration, and L2 exit handshake to optimize power efficiency and link reliability;</p><p>➂ UCIe 3.0 lays the foundation for future chiplet ecosystems, with commercial products expected around 2026-2028 as adoption by major semiconductor companies accelerates.</p>