<p>➀ The 2026 IEEE ECTC, a major semiconductor packaging industry event, will be held in Orlando, FL, from May 26-29, 2026, attracting over 2,000 participants worldwide;</p><p>➁ The conference will focus on cutting-edge topics like heterogeneous integration, chiplet architectures, hybrid bonding, 5G, quantum computing, and advanced packaging technologies;</p><p>➂ Submissions are invited for unpublished, non-commercial research in areas including reliability, manufacturing, material processing, and photonics.</p>
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