1. Alphawave Semi introduces the industry's first UCIe Die-to-Die IP at 3nm using TSMC's CoWoS advanced packaging technology; 2. The IP offers 8 Tbps/mm bandwidth density and supports 24 Gbps device-to-device data rates; 3. Aimed at hyperscale, high-performance computing, and AI applications, the IP features high interoperability and robust performance.