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thelec.net 主要提供关于SK Hynix、Samsung等韩国半导体行业的最新新闻，包括HBM、DRAM和NAND等信息。
June 11
- Samsung maintains hybrid bonding needed for HBM 16H1. Samsung has emphasized the necessity of hybrid bonding for the production of a 16-stack High Bandwidth Memory (HBM) in a recent paper. 2. The paper was presented at the 2024 IEEE 74th Electronic Components and Technology Conference in Colorado, discussing D2W (die to wafer) copper bonding.
- SK Materials Airplus to spend 700 billion won in chip gas1. SK Materials Airplus announced a 700 billion won investment to construct facilities for producing gaseous nitrogen (GN2) and clean dry air (CDA). 2. These gases are crucial for chip manufacturing processes. 3. GN2 serves as a carrier gas in wafer deposition and prevents oxidation.
June 8
- Chip market to grow 16% this year1. The global semiconductor market is projected to expand by 16% in the current year, as reported by World Semiconductor Trade Statistics (WSTS). 2. This growth will elevate the market value to $611.2 billion. 3. WSTS has revised its previous growth estimate from 13.1% to the current projection.
May 17
- South Korea to open AI chip center in San Jose1、韩国计划在美国圣何塞开设人工智能芯片创新中心，以促进国内系统芯片公司在美国的销售。2、该中心将为三到四家公司提供独立办公室，并提供一个大的开放空间供其他公司使用。3、该项目是韩国贸易、工业和能源部的一项计划，旨在推广系统半导体技术出口。
May 16
- LPKF to supply laser kit for glass chip boards to customers in Asia, CEO says1、LPKF 将为亚洲客户供应激光设备，用于生产玻璃芯片板。2、玻璃芯片板的生产需要经历通过玻璃维亚（TGV）过程。3、LPKF 的激光etching 技术可以解决TGV 过程中的障碍。
May 15
- WONST aims to hit 100 billion won in revenue this yearBearing maker WONST is targeting an annual revenue of 100 billion won this year, CEO Lee Taek-won told TheElec.The company is aiming to list on the Korean bourse next year on the back of hitting the revenue target, Lee said.WONST had originally aimed to go public this year, deciding on Shinhan Secur
May 14
- SK Hynix aims to manufacture HBM4E in 2026SK Hynix is planning to start mass production of HBM4E in 2026, a company research said.The South Korean memory maker originally planned to start mass production of the Gen 7 high-bandwidth memory (HBM) in 2027.But SK Hynix team leader and researcher Kwi Wook Kim said during International Memory Wee
- Raontech’s LCoS tech to go in Cadillac’s new EVSouth Korean microdisplay firm Raontech signed a deal with the UK’s Envisics to supply liquid crystal on silicon (LCoS) backplane wafers, TheElec has learned.Raontech said last month that it signed a deal worth 1.2 billion won to supply LCoS backplane wafers. It also signed a technology development
May 10
- CGP Materials aims for 150 billion won in revenue trough chip patterning materialCGP Materials is aiming to reach 150 billion won in annual revenue by 2027 through the expansion of its semiconductor patterning material business.The electronic material firm said on Thursday that it has started construction of a new factory in Sejong City.CGP Materials CEO Park Chun-geun said duri
- US chip production capacity to triple by 2032 thanks to CHIPS ActThe US chip production capacity is expected to triple from 2022 to 2032 from the enactment of the CHIPS and Science Act, but extending current support and considering additional measures was needed to “stay the course”, according to a joint report by the Semiconductor Industry Association (SIA) and
May 9
- Qualitas to raise funds for research into UCIe PHY IP for chipletsQualtias Semiconductor said on Tuesday that it will raise 59.5 billion won through a share offering.Out of the total, 57.5 billion won will be spent up to 2027 for the research and development of new chip IPs, the company said,49.5 billion won will be spent on next-generation products and the applic
- Worldwide chip revenues jump 15.2% in Q1The worldwide semiconductor industry is showing clear signs of a recovery.According to the Semiconductor Industry Association (SIA), the US trade body, worldwide semiconductor revenues jumped 15.2% on-year to US$137.7 billion in the first quarter. Revenues dropped 5.7% from the fourth quarter.The on
May 8
- Intel secures high-NA EUV kits over rivalsIntel has secured the majority of high-NA extreme ultraviolet (EUV) equipment that ASML is manufacturing up to the first half of next year, TheElec has learned,The Dutch fab equipment maker is manufacturing five units of the kit this year, which will all go to the US chipmaker, sources said.As ASML’
May 7
- Samsung takes two-track approach to HBM developmentSamsung is taking a two-track approach to its development of high-bandwidth memory (HBM).The company’s newly formed HBM development team, which was turned into a permanent office from a task force in March, is focusing on the development of HBM4, sources said. HBM4 is the sixth-generation iteration
May 3
- SK Hynix expects HBM revenue to hit mid-$10 billion within yearSK Hynix expects to hit an accumulated revenue of mid-US$10 billion in high-bandwidth memory (HBM) sales by the end of 2024.The memory maker has already sold out its HBM capacity for the year as well as those for 2025, SK Hynix CEO Kwak Noh-jung said during a press conference on Thursday at the comp
- SK Hynix testing Tokyo Electron’s cryo etching equipmentSK Hynix is testing the performance of Tokyo Electron’s cryogenic etching equipment, TheElec has learned.The South Korean memory chipmaker has sent test wafers to the fab equipment maker for the tests instead of installing them in its own fab, sources said.Tokyo Electron’s new kit etches at high spe
May 2
- LG Chem testing build-up film with FC-BGA customerSouth Korean chemical giant LG Chem was testing its own build-up film with a potential flip-chip ball grid array (FC-BGA) customer, a company researcher said.Builder-up films are an insulating film used in chip packages such as FC-BGA and glass substrates.The industry mostly uses Ajinomoto Build-Up
- Samsung returns to profitability in chips in first-quarterSamsung’s chip division has returned to profitability in the first quarter on the back of the recovery of the memory chip market.The South Korean electronics maker said on Tuesday that it recorded 71.92 trillion won in revenue and 6.61 trillion won in operating profit, an increase of 13% and 932%, r
April 30
- South Korea passes project to develop advanced chip packagingA national project to promote the development of advanced technologies in chip packaging has been passed by the South Korean government, TheElec has learned.It passed the preliminary feasibility review of Korea Institute of S&T Evaluation and Planning, a government think tank to set policies for sci
- Samsung considering applying metal oxide resist in next DRAMSamsung was considering applying metal oxide resist (MOR) during the extreme ultraviolet (EUV) lithography process for its next-generation DRAM, TheElec has learned.MOR is considered the next-generation photoresist (PR) to the chemically amplified resist (CAR) currently used in the lithography of ad
April 26
- SK Hynix returns to profitability on back of HBM salesSK Hynix has beat market estimates on its latest earnings on the back of rising prices of memory chip prices and strong sales of high-bandwidth memory (HBM).The South Korean chip giant said on Thursday that it recorded 12.42 trillion won in revenue and 2.88 trillion won in operating income in the fi
April 25
- LB Semicon to reduce reliance on DDISouth Korean chip assembly and test firm LB Semicon is aiming to reduce its reliance on display driver IC (DDI) for growth.LB Semicon vice president Kim Jeong-kyu told TheElec that last year was a time of reflection on what business areas it has invested in to plan where it wants to invest in the fu
April 24
- Philoptics supplies laser equipment to chipmaker for glass substrateBattery and display production equipment maker Philoptics said on Tuesday that it has supplied a piece of laser equipment to a chipmaker’s trial line for use in the production of a glass substrate.The equipment, called Through Glass Via (TGV), based on laser, was supplied to the potential customer l
- Samsung MX Business to use Sony’s OLEDoS over Samsung Display for XR deviceSamsung’s smartphone business is planning to use OLED on silicon (OLEDoS) from Sony for its extended reality (XR) device, TheElec has learned.Samsung MX Business’ decision to use the Japanese company’s technology over its affiliate Samsung Display, which has also been developing its own OLEDoS techn
April 23
- SK Hynix to use TSMC's base die for HBM4SK Hynix is planning to use TSMC’s base die technology for its next-generation high bandwidth memory (HBM).
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