1. TSMC is buying equipment for two CoWoS advanced packaging plants in Chiayi, Taiwan. 2. TSMC is also surveying land for a third CoWoS plant. 3. The new CoWoS plant in Nanke Chiayi Park is in the 'environmental review stage'. 4. TSMC's new advanced packaging plant will cover around 20 hectares. 5. The first CoWoS plant will be completed by 2026 and create 3000 jobs. 6. TSMC is preparing for future AI chips with its 3nm process and CoWoS-L packaging. 7. NVIDIA's future R100 AI GPU will use TSMC's 3nm process and CoWoS-L packaging with HBM4 memory.