1. Sarcina Technology introduces innovative advanced packaging solutions at #61DAC, focusing on cost-effective and reliable chiplet-based designs. 2. The company collaborates with Keysight Technologies to enhance design and test environments, enabling faster deployment in AI, autonomous driving, and quantum computing. 3. Sarcina's Bump Pitch Transformer package design, using silicon bridge technology, aims to increase interconnect density and democratize 2.5D era technologies.