➀ Counterpoint Research's analysis defines Foundry 2.0 as encompassing packaging and mask-making alongside wafer fabrication, with TSMC leading at 35% market share and Intel ranking second at 6.5%;

➁ The expanded definition may mitigate monopoly concerns for TSMC, whose traditional wafer fabbing dominance reaches nearly 70%;

➂ The Foundry 2.0 market reached $72 billion in Q1 2025, with Intel gaining 0.6% quarterly market share but declining 0.3% year-over-year.

➀ TSMC's 2nm process yield surpasses 60%, meeting HVM requirements for stable production;

➁ Samsung's 2nm yield lags at 40%, prompting major clients like AMD, Nvidia, and Apple to prioritize TSMC capacity;

➂ TSMC's 2nm wafer price approaches $30,000, with future 1.4nm costs projected to reach $45,000 by 2028.

➀ Tesla developed a groundbreaking 'Stress' tool to detect defective cores in its wafer-scale Dojo processors, critical for preventing silent data corruption that could invalidate weeks of AI training;

➁ Each Dojo 'Training Tile' contains 8,850 RISC-V cores and leverages TSMC's InFO_SoW packaging, with Stress enabling real-time monitoring across millions of cores without downtime;

➂ The method not only identifies faulty cores but also exposed rare design flaws, positioning Tesla alongside Google and Meta in hardware reliability while shaping future wafer-scale chip adoption.

➀ TSMC's A16 (1.6nm) wafer prices may surge to $45,000, marking a 50% increase over N2 (2nm) nodes;

➁ Backside Power Delivery Network (BSPDN) technology drives higher costs, benefiting AI/HPC chips but requiring complex manufacturing steps;

➂ Chip development costs for N2 nodes could reach $725 million, limiting adoption to major players like Apple, NVIDIA, and Qualcomm.

➀ U.S. bans EDA software exports to China, blocking updates for Synopsys/Cadence users;

➁ Xiaomi (3nm XRing 01 SoC), Lenovo and Bitmain's advanced chip designs impacted;

➂ Chinese EDA tools (Empyrean/Primarius/Semitronix) lag in cutting-edge nodes but advance in localization.

➀ Intel collaborates with SoftBank to develop stacked DRAM alternatives to HBM through joint venture Saimemory, targeting commercialization by 2030;

➁ NVIDIA unveils plans for a China-compliant B30 AI chip with multi-GPU scaling, circumventing export controls;

➂ TSMC explores building a UAE-based fab with US government support, mirroring its Arizona project scale.