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May 1
- China Breaks EUV Light Source Barrier, Builds New Experimental Platform
➀ China has achieved a breakthrough in semiconductor research by establishing a fully functional EUV light source experimental platform;
➁ The Shanghai Institute of Optics and Fine Mechanics has reached a peak energy conversion efficiency of 3.42% in their EUV development efforts;
➂ This progress underscores China's commitment to technological independence despite increasing US export restrictions;
➃ China has become ASML's largest single market, accounting for 36.1% of total sales.
- Samsung Exits HBM2E Market, Focuses on HBM3E and HBM4
➀ Samsung Electronics is reducing production of DDR4 memory and scaling back its HBM2E business to focus on HBM3E and HBM4 products.
➁ Analysts believe this move is a response to the rise of Chinese firms in mature-process memory, forcing Samsung to retreat from segments with intense low-cost competition.
➂ Samsung is aiming to pass Nvidia's HBM3E certification to boost production and gain early leadership in the emerging HBM4 market.
October 17
- ASML Launches 2025 EUV Pricing Offensive and Defensive War, Tightens TSMC's Only Weakness and Reverse Increases
➀ ASML's order book and outlook have been revised downwards, primarily due to cuts in orders from Samsung Electronics and Intel.
➁ ASML and TSMC are expected to begin negotiating the 2025 equipment procurement prices, with ASML possibly adjusting prices in reverse.
➂ The negotiation results between the two companies will not only affect ASML's future performance growth but also affect the pricing of equipment manufacturers in Europe, America, and Japan.
August 20
- Intel's Layoffs vs Samsung's Labor Disputes: Shaping Future Semiconductor Competition➀ Intel announces plans to cut 15% of its workforce, aiming to save US$10 billion by 2025 due to underwhelming financial results. ➁ CEO Pat Gelsinger cites high-cost, low-margin structure and inability to capitalize on AI trends as reasons for restructuring. ➂ Samsung's semiconductor division faces ongoing labor strikes despite similar revenue declines, highlighting the rigidity of South Korea's labor market.
August 19
- Daxin Develops Chipmaking Materials for 2nm, CoWoS➀ Daxin Materials has developed chipmaking materials supporting advanced 2nm manufacturing processes and CoWoS packaging. ➁ The company provides specialty chemicals for semiconductor, display, and key raw materials. ➂ Daxin continues to increase revenue generated from these advanced materials.
May 9
- 2024年中國晶圓代工業營收估回溫 然成長率將遜於全球水準DIGITIMES Research統計，2023年中國晶圓代工產業營收達114億美元，年減16%，減幅低於全球晶圓代工產業平均水準(-13%)；展望2024年，DIGITIMES Research預估中.......
April 21
- 2024年全球晶圓代工業營收將成長17% 生成式AI應用為帶動成長主因DIGITIMES Research觀察，2023年總體經濟成長動能較2022年疲軟，且電子產業庫存調整期程較預期更長的背景下，2023年全球晶圓代工產業營收下滑至1,224億美元，較2......
- 2024年全球晶圓代工業營收將成長17% 生成式AI應用為帶動成長主因