digitimes
Author page description
October 17
- ASML Launches 2025 EUV Pricing Offensive and Defensive War, Tightens TSMC's Only Weakness and Reverse Increases
➀ ASML's order book and outlook have been revised downwards, primarily due to cuts in orders from Samsung Electronics and Intel.
➁ ASML and TSMC are expected to begin negotiating the 2025 equipment procurement prices, with ASML possibly adjusting prices in reverse.
➂ The negotiation results between the two companies will not only affect ASML's future performance growth but also affect the pricing of equipment manufacturers in Europe, America, and Japan.
August 20
- Intel's Layoffs vs Samsung's Labor Disputes: Shaping Future Semiconductor Competition➀ Intel announces plans to cut 15% of its workforce, aiming to save US$10 billion by 2025 due to underwhelming financial results. ➁ CEO Pat Gelsinger cites high-cost, low-margin structure and inability to capitalize on AI trends as reasons for restructuring. ➂ Samsung's semiconductor division faces ongoing labor strikes despite similar revenue declines, highlighting the rigidity of South Korea's labor market.
August 19
- Daxin Develops Chipmaking Materials for 2nm, CoWoS➀ Daxin Materials has developed chipmaking materials supporting advanced 2nm manufacturing processes and CoWoS packaging. ➁ The company provides specialty chemicals for semiconductor, display, and key raw materials. ➂ Daxin continues to increase revenue generated from these advanced materials.
May 9
- 2024年中國晶圓代工業營收估回溫 然成長率將遜於全球水準DIGITIMES Research統計，2023年中國晶圓代工產業營收達114億美元，年減16%，減幅低於全球晶圓代工產業平均水準(-13%)；展望2024年，DIGITIMES Research預估中.......
April 21
- 2024年全球晶圓代工業營收將成長17% 生成式AI應用為帶動成長主因DIGITIMES Research觀察，2023年總體經濟成長動能較2022年疲軟，且電子產業庫存調整期程較預期更長的背景下，2023年全球晶圓代工產業營收下滑至1,224億美元，較2......
- 2024年全球晶圓代工業營收將成長17% 生成式AI應用為帶動成長主因