➀ Micron is reportedly acquiring two factories from AUO in the Tainan Science Park Industrial Zone for an estimated price of one to two billion New Taiwan dollars. ➁ The acquisition aims to expand Micron's advanced packaging and high bandwidth memory (HBM) production lines. ➂ AUO has confirmed adjustments in production scale at its Tainan site and plans to activate the use of existing facilities at an appropriate time.

1. The advanced packaging market is projected to grow at a CAGR of 11% to reach $69.5 billion by 2029. 2. Key players in the market include ASE, Amkor, TSMC, Intel, and JCET. 3. Government investments and strategic partnerships are driving the transformation of the AP supply chain.

1. Advanced packaging revenue decreased by 9% in Q1 2024, reaching $10.2 billion. 2. The quarter is expected to be the weakest of the year, with an 8.1% decline from the previous quarter. 3. Recovery in the advanced packaging market is anticipated in 2024.

1. The U.S. Department of Commerce announced a $1.6 billion competition for semiconductor advanced packaging R&D projects; 2. The funding will support five R&D areas including equipment, power delivery, connector technology, chiplets ecosystem, and co-design/EDA; 3. This initiative aims to strengthen the U.S. semiconductor ecosystem and address strategic vulnerabilities in advanced packaging.