➀ Amkor and TSMC announce a MoU to expand partnership; ➁ Collaboration focuses on advanced packaging and test capabilities; ➂ Aim to enhance Arizona's semiconductor ecosystem.

➀ The adoption of chiplets in domain-specific applications is creating complex partitioning challenges; ➁ Major companies are focusing on chiplets to improve performance and reduce power; ➂ Partitioning involves mapping optimal data paths, load balancing, and signal path workarounds; ➃ The shift towards chiplets is driven by scaling benefits limitations; ➄ Chiplets are assembled into advanced packages, affecting partitioning complexity; ➅ Partitioning determines application mapping, processing, and data movement priorities; ➆ Signal integrity challenges and power integrity issues arise with chiplet design; ➇ Chiplet partitioning must consider signal integrity, power integrity, and thermal gradients; ➈ Multi-vendor ecosystems and standard chiplet sockets are crucial for successful partitioning.

➀ SiCool Technology has secured a billion-dollar strategic financing, led by Zhongche Capital, Wan Niu Capital, and Wenxin Fund. The funds will be used for the mass delivery of silicon carbide pre-sintered bonding equipment and the commercialization of advanced packaging HBM equipment. ➁ SiCool Technology, founded in December 2018, specializes in chip interconnection technology and has become a leader in the domestic substitution of carbonized silicon pre-sintered bonding equipment. ➂ The company's products include high-precision chip bonding equipment for various scenarios, covering mobile module, power semiconductor, AI chip industry, and advanced packaging bonder. ➃ SiCool Technology will continue to focus on high-precision, high-reliability, and high-efficiency motion control core technology and plan to expand into power semiconductor, carbon silicon, and AI chip HBM directions.

➀ Sales of advanced packaging equipment are projected to increase by over 10% in 2024 and potentially exceed 20% in 2025. ➁ The demand for AI servers is driving the development of advanced packaging technologies like InFO, CoWoS, and SoIC. ➂ Major companies are expanding their advanced packaging capacities globally, with new facilities being established by TSMC, Intel, Samsung, SK hynix, and Micron.

➀ The demand for High Bandwidth Memory (HBM) is increasing due to the growth of AI models, which require more parameters and energy-efficient training and inference. ➁ HBM is expected to grow at a CAGR of 50% in the coming years, driving the need for advanced DRAM wafer processing equipment and HBM stack creation. ➂ Applied Materials is a leading supplier in this field, with over 50% share in HBM packaging process equipment spending and significant innovations in DRAM processing and 3D packaging technologies.

➀ Sales of advanced packaging equipment expected to grow by over 10% in 2024; ➁ Potential for growth to exceed 20% in 2025; ➂ Driven by expansion of advanced packaging capacity by major semiconductor manufacturers and the global AI server market.

➀ Micron is reportedly acquiring two factories from AUO in the Tainan Science Park Industrial Zone for an estimated price of one to two billion New Taiwan dollars. ➁ The acquisition aims to expand Micron's advanced packaging and high bandwidth memory (HBM) production lines. ➂ AUO has confirmed adjustments in production scale at its Tainan site and plans to activate the use of existing facilities at an appropriate time.

1. The advanced packaging market is projected to grow at a CAGR of 11% to reach $69.5 billion by 2029. 2. Key players in the market include ASE, Amkor, TSMC, Intel, and JCET. 3. Government investments and strategic partnerships are driving the transformation of the AP supply chain.

1. Advanced packaging revenue decreased by 9% in Q1 2024, reaching $10.2 billion. 2. The quarter is expected to be the weakest of the year, with an 8.1% decline from the previous quarter. 3. Recovery in the advanced packaging market is anticipated in 2024.

1. The U.S. Department of Commerce announced a $1.6 billion competition for semiconductor advanced packaging R&D projects; 2. The funding will support five R&D areas including equipment, power delivery, connector technology, chiplets ecosystem, and co-design/EDA; 3. This initiative aims to strengthen the U.S. semiconductor ecosystem and address strategic vulnerabilities in advanced packaging.