➀ Sales of advanced packaging equipment expected to grow by over 10% in 2024; ➁ Potential for growth to exceed 20% in 2025; ➂ Driven by expansion of advanced packaging capacity by major semiconductor manufacturers and the global AI server market.
Related Articles
- Advanced Packaging expands its footprint11 months ago
- YES Pioneers Semiconductor Equipment Production in India4 months ago
- The Transformative Growth Potential of the Semiconductor Industry4 months ago
- Imec and ASML sign five year R&D agreement4 months ago
- Huzhou Team Breaks International Chip Advanced Packaging Monopoly, Secures Hundreds of Millions in Financing | 36Kr Exclusive4 months ago
- Semiconductor OSAT Giants' Expansion into Advanced Packaging5 months ago
- UMC Secures Major Advanced Packaging Order from Qualcomm, Challenging TSMC’s Dominance7 months ago
- European Chiplet Innovation: APECS Pilot Line Starts Operation under the EU Chips Act7 months ago
- Chiplet Innovations for Europe: Launch of APECS Pilot Line under the EU Chips Act7 months ago
- Jiangsu's First Semiconductor IPO This Year Surges 568%: Two Equipment Leaders Hold Shares7 months ago